公开(公告)号：US09773752B2

公开(公告)日：2017-09-26

申请号：US15221164

申请日：2016-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-hyun Baik ,  Cheol-woo Lee ,  Wan-ho Park

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0652 ,  H01L23/3128 ,  H01L24/06 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: A printed circuit board (PCB) for reducing a size of a semiconductor package and a semiconductor package including the same are provided. The PCB includes a substrate base including a chip attach area disposed on a top thereof, a top pad and a bottom pad respectively disposed on the top and a bottom of the substrate base, a first top solder resist layer formed on the top of the substrate base and including a first pad opening corresponding to the top pad and covering the chip attach area, a second top solder resist layer formed on the first top solder resist layer and including a second pad opening corresponding to the top pad and a chip attach opening corresponding to the chip attach area, and a bottom solder resist layer formed on the bottom of the substrate base and including a third pad opening corresponding to the bottom pad.

公开(公告)号：US09871180B2

公开(公告)日：2018-01-16

申请号：US14096560

申请日：2013-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-young Choi ,  Seung-hyun Baik ,  Won-young Kim ,  Dae-woo Suh ,  Sang-hoon Lee ,  Seung-hyun Hong

IPC: H01L35/26 ,  H01L35/18 ,  H01L35/02 ,  H01L35/24 ,  H01L35/16 ,  B82Y99/00 ,  H01L35/14 ,  H01L35/12

CPC classification number: H01L35/26 ,  B82Y99/00 ,  H01L35/02 ,  H01L35/12 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/24 ,  Y10S977/742 ,  Y10S977/948

Abstract: A thermoelectric material includes a stack structure including alternately stacked first and second material layers. The first material layer may include a carbon nano-material. The second material layer may include a thermoelectric inorganic material. The first material layer may include a thermoelectric inorganic material in addition to the carbon nano-material. The carbon nano-material may include, for example, graphene. At least one of the first and second material layers may include a plurality of nanoparticles. The thermoelectric material may further include at least one conductor extending in an out-of-plane direction of the stack structure.

公开(公告)号：US10024585B2

公开(公告)日：2018-07-17

申请号：US14018752

申请日：2013-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-young Choi ,  Seung-hyun Baik ,  Seung-hyun Hong ,  Won young Kim

IPC: F25B21/02 ,  H01L35/16 ,  H01L35/34 ,  H01L35/32 ,  H01L35/24

Abstract: A heat radiation-thermoelectric fin includes a thermoelectric inorganic material on a heterogeneous laminate of graphene. The heterogeneous laminate may be tube-shaped or plate-shaped, and a metal conductor may be coupled to one or more of the heterogeneous laminate. A thermoelectric module may be formed to include the fin, and a thermoelectric apparatus may include a heat supplier connected to the thermoelectric module.

公开(公告)号：US09070824B2

公开(公告)日：2015-06-30

申请号：US13729820

申请日：2012-12-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-young Choi ,  Seung-hyun Baik ,  Seung-hyun Hong ,  Won-young Kim ,  Eun-sung Kim ,  Young-hee Lee

IPC: H01L35/22 ,  H01L35/16 ,  H01L35/32 ,  H01L35/34 ,  H01L35/18

CPC classification number: H01L35/22 ,  C01B32/184 ,  H01L35/16 ,  H01L35/32 ,  H01L35/34 ,  Y02P20/133

Abstract: A heterogeneous laminate including: graphene; and a thermoelectric inorganic compound disposed on the graphene.

Abstract translation: 异质层压板包括：石墨烯; 以及设置在石墨烯上的热电无机化合物。