公开(公告)号：US20210156031A1

公开(公告)日：2021-05-27

申请号：US16932194

申请日：2020-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong PARK ,  Mitsuaki KOMINO ,  Kyungwon KANG ,  Wonguk SEO ,  Sunggwang LEE ,  Sunghwan LEE

IPC: C23C16/52 ,  C23C16/56 ,  G03F7/16

Abstract: An apparatus for processing a substrate may include a mixture bath, a plurality of reaction chambers and a control module. The mixture bath may be configured to receive a plurality of chemicals to form a mixture. Each of the reaction chambers may be configured to receive a respective substrate of a plurality of the substrates to be processed by the mixture. The control module may be configured to control supply of the mixture supplied from the mixing bath to the reaction chambers with a uniform concentration.

公开(公告)号：US20220344181A1

公开(公告)日：2022-10-27

申请号：US17666796

申请日：2022-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumjin JANG ,  Seunghwa KANG ,  Sungyong PARK ,  Ansook SUL ,  Kiju SOHN ,  Wonguk SEO

IPC: H01L21/67 ,  H01L21/324

Abstract: A baking apparatus, may include a processing chamber including a lower chamber and an upper chamber connected by a ring shutter; a baking plate in the processing chamber adjacent to a region in which the lower chamber and the ring shutter overlap; an active flow controller including a first module and a second module in the lower chamber adjacent to the baking plate; a first auxiliary flow controller on a lower part of the ring shutter, adjacent to the lower chamber; and a second auxiliary flow controller in the upper chamber adjacent to the ring shutter. The active controller may be configured to move based on movement of the first module in a first direction perpendicular to an upper surface of the baking plate. The active flow controller may be configured to control airflow around the second module by movement of the second module.