公开(公告)号：US20210156031A1

公开(公告)日：2021-05-27

申请号：US16932194

申请日：2020-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong PARK ,  Mitsuaki KOMINO ,  Kyungwon KANG ,  Wonguk SEO ,  Sunggwang LEE ,  Sunghwan LEE

IPC: C23C16/52 ,  C23C16/56 ,  G03F7/16

Abstract: An apparatus for processing a substrate may include a mixture bath, a plurality of reaction chambers and a control module. The mixture bath may be configured to receive a plurality of chemicals to form a mixture. Each of the reaction chambers may be configured to receive a respective substrate of a plurality of the substrates to be processed by the mixture. The control module may be configured to control supply of the mixture supplied from the mixing bath to the reaction chambers with a uniform concentration.

公开(公告)号：US20200344435A1

公开(公告)日：2020-10-29

申请号：US16587531

申请日：2019-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik CHOI ,  Jungrae KIM ,  Jinyong PARK ,  Hyunyong CHOI ,  Dongwook HAN ,  Jina KWON ,  Hayeon KIL ,  Kyoungmin KIM ,  Youngjin KIM ,  Sungyong PARK ,  Siyoung PARK ,  Yongwoo SHIN ,  Daesik YOON ,  Eunjoo CHO ,  Jungyon CHO

IPC: H04N5/44 ,  G06F3/14 ,  G06F3/16

Abstract: A display device and a method capable of rotating a display based on a type of a user command are provided. The display device according to the disclosure receives a user command while first content is displayed on the display, the display being configured to operate in a first orientation while displaying the first content, maintains the display to operate in the first orientation when the received user command is a command to control a feature corresponding to the first content, determines, based on a type of a second content, to control the display to operate in the first orientation or a second orientation different from the first orientation when the received user command is a command to display the second content on the display, and controls the motor to rotate the display based on the determined first orientation or the second orientation.

公开(公告)号：US20210274236A1

公开(公告)日：2021-09-02

申请号：US17322148

申请日：2021-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik CHOI ,  Jungrae KIM ,  Jinyong PARK ,  Hyunyong CHOI ,  Dongwook HAN ,  Jina KWON ,  Hayeon KIL ,  Kyoungmin KIM ,  Youngjin KIM ,  Sungyong PARK ,  Siyoung PARK ,  Yongwoo SHIN ,  Daesik YOON ,  Eunjoo CHO ,  Jungyon CHO

IPC: H04N21/422 ,  G06F3/16 ,  G06F3/14

Abstract: A display device and a method capable of rotating a display based on a type of a user command are provided. The display device according to the disclosure receives a user command while first content is displayed on the display, the display being configured to operate in a first orientation while displaying the first content, maintains the display to operate in the first orientation when the received user command is a command to control a feature corresponding to the first content, determines, based on a type of a second content, to control the display to operate in the first orientation or a second orientation different from the first orientation when the received user command is a command to display the second content on the display, and controls the motor to rotate the display based on the determined first orientation or the second orientation.

公开(公告)号：US20210028034A1

公开(公告)日：2021-01-28

申请号：US16751882

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngho HWANG ,  Sungyong PARK ,  Eunseok SEO ,  Hyeongseok JO ,  Seok HEO

IPC: H01L21/67 ,  G05B19/418 ,  G05D23/19 ,  G05D16/20 ,  H05B1/02

Abstract: A wafer processing apparatus is provided. The apparatus includes: a heating plate through which vacuum ports are formed; a plurality of temperature sensors; a heating device configured to heat the heating plate; first and second power supplies; temperature controllers to generate first and second feedback temperature control signals for controlling power output power supplies based on measurement values generated by the temperature sensors; an electronic pressure regulator configured to provide vacuum pressure for fixing a wafer to the plurality of vacuum ports; and a wafer chucking controller configured to control the electronic pressure regulator, and generate a feedback pressure control signal for controlling the electronic pressure regulator based on the first and second feedback temperature control signals.

公开(公告)号：US20250135600A1

公开(公告)日：2025-05-01

申请号：US18906603

申请日：2024-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngtaek KIM ,  Domin KIM ,  Sungyong PARK ,  Chansoo PARK ,  Kyoungwhan OH ,  Jaemin JUNG ,  Hoseop CHOI

IPC: B24B37/27 ,  B24B37/015

Abstract: A polishing head may include a substrate carrier detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier includes a flexible membrane, wherein the flexible membrane includes a main thin film having a first surface to be in contact with the substrate and a second surface opposite to the first surface and a plurality of vertical thin films extending from the main thin film in a vertical direction to define a plurality of pressurizing chambers that are divided along a radial direction about a central axis; a plurality of temperature elements disposed under the plurality of pressurizing chambers in the main thin film and configured to apply local heat to the substrate; and a plurality of pressure elements respectively disposed on the plurality of temperature elements in the main thin film and configured to apply local pressure to the main thin film.

公开(公告)号：US20240208005A1

公开(公告)日：2024-06-27

申请号：US18226873

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jubong LEE ,  Jongsu KIM ,  Sungyong PARK ,  Bongki PARK ,  Eunsun PARK ,  Hyunjoon PARK ,  Hoseop CHOI

IPC: B24B53/017 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B37/005 ,  B24B37/04

Abstract: A cleaner for a CMP apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. The cleaning body may be arranged under a polishing head of the CMP apparatus configured to hold a substrate. The cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. The cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. The vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. The controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. Thus, a scratch caused by a defect may not be generated at the substrate.

公开(公告)号：US20220344181A1

公开(公告)日：2022-10-27

申请号：US17666796

申请日：2022-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumjin JANG ,  Seunghwa KANG ,  Sungyong PARK ,  Ansook SUL ,  Kiju SOHN ,  Wonguk SEO

IPC: H01L21/67 ,  H01L21/324

Abstract: A baking apparatus, may include a processing chamber including a lower chamber and an upper chamber connected by a ring shutter; a baking plate in the processing chamber adjacent to a region in which the lower chamber and the ring shutter overlap; an active flow controller including a first module and a second module in the lower chamber adjacent to the baking plate; a first auxiliary flow controller on a lower part of the ring shutter, adjacent to the lower chamber; and a second auxiliary flow controller in the upper chamber adjacent to the ring shutter. The active controller may be configured to move based on movement of the first module in a first direction perpendicular to an upper surface of the baking plate. The active flow controller may be configured to control airflow around the second module by movement of the second module.