公开(公告)号：US20240194577A1

公开(公告)日：2024-06-13

申请号：US18239167

申请日：2023-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonyoung Jeon ,  Youngmin Kim ,  Joonseok Oh ,  Woongkeon Lee ,  Changbo Lee

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/08

Abstract: A semiconductor package includes a first redistribution structure having at least one first redistribution layer and at least one first insulating layer that are alternately stacked, a semiconductor chip electrically connected to the first redistribution structure, a second insulating layer disposed above the semiconductor chip and having an opening, a pad electrically connected to the first redistribution structure, disposed on the second insulating layer, and overlapping the opening, a pad surface layer disposed on a first region of an upper surface of the pad to overlap the opening, the pad surface layer formed of a first conductive material different from a second conductive material forming the pad. The pad has an anchor portion protruding from a second region of the upper surface of the pad. The anchor portion protrudes to a position higher than that of a lower surface of the pad surface layer.