SEMICONDUCTOR DEVICE
    1.
    发明公开

    公开(公告)号:US20240194577A1

    公开(公告)日:2024-06-13

    申请号:US18239167

    申请日:2023-08-29

    Abstract: A semiconductor package includes a first redistribution structure having at least one first redistribution layer and at least one first insulating layer that are alternately stacked, a semiconductor chip electrically connected to the first redistribution structure, a second insulating layer disposed above the semiconductor chip and having an opening, a pad electrically connected to the first redistribution structure, disposed on the second insulating layer, and overlapping the opening, a pad surface layer disposed on a first region of an upper surface of the pad to overlap the opening, the pad surface layer formed of a first conductive material different from a second conductive material forming the pad. The pad has an anchor portion protruding from a second region of the upper surface of the pad. The anchor portion protrudes to a position higher than that of a lower surface of the pad surface layer.

    TRANSCEIVER USING ACTIVE DEVICE ARRAY AND ANTENNA MODULE INCLUDING THE SAME

    公开(公告)号:US20210351797A1

    公开(公告)日:2021-11-11

    申请号:US17379461

    申请日:2021-07-19

    Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.

    Transceiver using active device and antenna module including the same

    公开(公告)号:US12074630B2

    公开(公告)日:2024-08-27

    申请号:US17874717

    申请日:2022-07-27

    CPC classification number: H04B1/401 H03K17/6872

    Abstract: A transceiver includes a first integrated circuit, a second integrated circuit and an antenna array. The first integrated circuit including a transmission chain, a reception chain, and a control circuit, the transmission chain configured to transmit a first radio frequency (RF) signal and the reception chain configured to receive a second RF signal, and the control circuit configured to selectively ground any one of the transmission chain and the reception chain according to a transmission mode or a reception mode; the second integrated circuit including an active device connected to the transmission chain and the reception chain; and the antenna array including an antenna connected to the active device.

    Display apparatus and control method thereof

    公开(公告)号:US11244652B2

    公开(公告)日:2022-02-08

    申请号:US16567725

    申请日:2019-09-11

    Inventor: Youngmin Kim

    Abstract: A display apparatus includes a display; an optical sensor; and a processor configured to: obtain a current illumination value detected by the optical sensor while the display displays an image, identify a first illumination level corresponding to the obtained current illumination value, the first illumination level being previously obtained at a time when the display is displaying a preset image, identify an ambient brightness based on a second illumination level, the second illumination level corresponding to the identified first illumination level and being previously obtained at a time when the display is not displaying any image, and perform an operation based on the identified ambient brightness.

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