公开(公告)号：US11887868B2

公开(公告)日：2024-01-30

申请号：US17215928

申请日：2021-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-hoo Kim ,  Sang-jine Park ,  Yong-jhin Cho ,  Yeon-jin Gil ,  Ji-hoon Jeong ,  Byung-kwon Cho ,  Yong-sun Ko ,  Kun-tack Lee

IPC: H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  H01L21/687

CPC classification number: H01L21/67034 ,  B08B7/0021 ,  H01L21/6719 ,  H01L21/67126 ,  H01L21/68735 ,  H01L21/02101

Abstract: A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.