公开(公告)号：US20190115325A1

公开(公告)日：2019-04-18

申请号：US15968143

申请日：2018-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Hyeok IM ,  Hee Seok LEE ,  Tae Woo KANG ,  Yeong Seok KIM ,  Kyoung-Min LEE

IPC: H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/498

Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

公开(公告)号：US20220026485A1

公开(公告)日：2022-01-27

申请号：US17211385

申请日：2021-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeong Seok KIM ,  Suk Byung CHAE ,  Dong Soo LEE ,  Sang Ho JANG

IPC: G01R31/28

Abstract: A test handler includes a pusher which includes a pusher end which comes into contact with a DUT (Device Under Test) to transfer heat, and a pusher body which conducts heat to the pusher end, the pusher end separating a test tray for fixing the DUT and the pusher body from each other; a porous match plate including a pusher arrangement region in which the pusher body is placed, and a plurality of holes placed adjacent to the pusher arrangement region; a heater placed on an upper surface of the porous match plate to control temperature of the pusher; and an airflow input port placed on the heater to provide the airflow to the plurality of holes, in which the airflow passes through the plurality of holes and passes through a separated space between the test tray and the pusher body.