公开(公告)号：US20190279846A1

公开(公告)日：2019-09-12

申请号：US16421433

申请日：2019-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeongkwang LEE ,  Sunggil KANG ,  Sang Ki NAM ,  Kwangyoub HEO ,  Kyuhee HAN

IPC: H01J37/32

Abstract: A chamber has an upper housing and a lower housing and receives a reaction gas. A first plasma source includes electron beam sources providing electron beams into the upper housing to generate an upper plasma. A second plasma source includes holes generating a lower plasma within the holes connecting the upper housing and the lower housing. Radicals of the upper plasma, radicals of the lower plasma, and ions of the lower plasma are provided, through the holes, to the lower housing so that the lower housing has radicals and ions at a predetermined ratio of the ions to the radicals in concentration. The second plasma source divides the chamber into the upper housing and the lower housing. A wafer chuck is positioned in the lower housing to receive a wafer.

公开(公告)号：US20240159657A1

公开(公告)日：2024-05-16

申请号：US18202663

申请日：2023-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sejin OH ,  Sunggil KANG ,  Sangki NAM ,  Jeongmin BANG ,  Dougyong SUNG ,  Yeongkwang LEE ,  Sungho JANG ,  Jonghun PI

IPC: G01N21/25 ,  G01N21/31 ,  H01L21/67

CPC classification number: G01N21/255 ,  G01N21/3103 ,  H01L21/67069 ,  G01N2201/061 ,  G01N2201/062

Abstract: Provided is an apparatus configured to measure radical spatial density distribution including a process chamber including a viewport, a driving device configured to move a moving wall inside the process chamber, a light source configured to generate light, a collimator disposed in the viewport of the process chamber and configured to transmit light received from the light source to the moving wall and receive light reflected from the moving wall, and a spectrometer configured to receive the reflected light from the collimator, and measure radical spatial density based on analyzing an absorption amount of a spectrum of the received light.

公开(公告)号：US20210098232A1

公开(公告)日：2021-04-01

申请号：US16860745

申请日：2020-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjin AN ,  Minseop PARK ,  Chanyeong JEONG ,  Sunggil KANG ,  Yeongkwang LEE

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/3065 ,  H01L21/683

Abstract: A substrate processing apparatus includes a process chamber including a plasma generation region configured to receive at least one first process gas and have first radio-frequency (RF) power applied thereto, to generate plasma; a gas distribution region configured to supply the at least one first process gas to the plasma generation region; a gas mixing region configured to receive at least one second process gas and radicals generated in the plasma generation region to generate an etchant based on the radicals being mixed with the at least one second process gas; a pedestal on which a substrate is disposed; a processing region in which the pedestal is installed; and a shower head configured to supply the etchant from the gas mixing region to the processing region, the substrate disposed on the pedestal being processed by the etchant. The gas mixing region is separate from each of the plasma generation region and the processing region.