Image sensor
    2.
    发明授权

    公开(公告)号:US12136643B2

    公开(公告)日:2024-11-05

    申请号:US17720010

    申请日:2022-04-13

    Abstract: An image sensor may include a first substrate having first and second surfaces and including unit pixel regions, each of which includes a device isolation pattern and a photoelectric conversion region adjacent to the first surface of the first substrate, a pixel isolation pattern provided in the first substrate to define the unit pixel regions and to penetrate the device isolation pattern, a first impurity region and a floating diffusion region provided in the first substrate and adjacent to the first surface, a second substrate provided on the first substrate to have third and fourth surfaces, a second impurity region provided in the second substrate and adjacent to the third surface, and ground and body contacts coupled to the first and second impurity regions, respectively. The ground contact and the body contact may be electrically separated from each other.

    GRID STRUCTURE FOR FIXING SPECIMEN
    3.
    发明公开

    公开(公告)号:US20240242989A1

    公开(公告)日:2024-07-18

    申请号:US18406925

    申请日:2024-01-08

    CPC classification number: H01L21/67336 H01J37/20

    Abstract: The present disclosure describes example apparatuses (e.g., grid structures) for fixing or holding a specimen, where the grid structure is formed by alternately stacking different layers (e.g., silicon (Si) layers and silicon germanium (SiGe) layers). For example, the alternate layers may be visually distinguishable from each other and may have a configured thickness. As such, based on the visual distinguishability between layers and the configured thickness for each layer, the grid structure may be used to adjust the magnification during inspection of the specimen. For example, the stacked layers may serve as a scale to control the magnification of the electron microscope while inspecting the specimen based on the configured or known thickness of the layers. Additionally, the orientation of the stacked layers may be used as a reference when a specimen is inspected.

    SAMPLE HOLDER OF TRANSMISSION ELECTRON MICROSCOPE AND SEMICONDUCTOR DEVICE INSPECTION METHOD USING THE SAMPLE HOLDER

    公开(公告)号:US20240105417A1

    公开(公告)日:2024-03-28

    申请号:US18202155

    申请日:2023-05-25

    CPC classification number: H01J37/20 H01J37/261 H01J2237/2007

    Abstract: A sample holder includes a head, a first holding plate extending in a first direction from one surface of the head and including at least one first sample hole configured to accommodate at least one first sample and a first main surface configured such that the at least one first sample accommodated in the at least one first sample hole is exposed at the first main surface, and a second holding plate extending in the first direction from the one surface of the head and including at least one second sample hole configured to accommodate at least one second sample and a second main surface configured such that the at least one second sample accommodated in the at least one second sample hole is exposed at the second main surface, wherein a direction perpendicular to the first main surface of the first holding plate differs from a direction perpendicular to the second main surface of the second holding plate.

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