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公开(公告)号:US20230096434A1
公开(公告)日:2023-03-30
申请号:US17704177
申请日:2022-03-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jinduck PARK , Chansik KWON , Yongseong KIM , Inwook IM , Jiyeon HAN
IPC: H01L23/00 , H01L23/522 , H01L23/528
Abstract: A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least partially defining a recessed region that is in the edge region such that the side surface of the wiring layer is exposed by the recessed region, and an upper insulating layer on the wiring layer. The recessed region extends from a side surface of the device layer toward the device region. A first portion of the upper insulating layer covers the side surface of the wiring layer that is exposed by the recessed region.
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2.
公开(公告)号:US20210227185A1
公开(公告)日:2021-07-22
申请号:US16995085
申请日:2020-08-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dahee LEE , Yongseong KIM , Youngmi JO , Dongki MIN , Wooseok CHOI
Abstract: An image sensor including a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, and k number of sub-pixels representing one color pixel in conjunction with each other, where k is an integer equal to or greater than four and calibration circuitry may be provided. The calibration circuitry may be configured to receive digital image signal generated based on pixel signals output from the pixel array, calculate a color gain of the digital image signal based on a coefficient set calculated based on a reference image signal generated by a reference image sensor under a first light source having a first color temperature, store coefficient sets associated with a plurality of color temperatures including the first color temperature, and apply the color gain to the digital image signal to generate a calibrated image signal.
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