公开(公告)号：US20230096434A1

公开(公告)日：2023-03-30

申请号：US17704177

申请日：2022-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinduck PARK ,  Chansik KWON ,  Yongseong KIM ,  Inwook IM ,  Jiyeon HAN

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/528

Abstract: A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least partially defining a recessed region that is in the edge region such that the side surface of the wiring layer is exposed by the recessed region, and an upper insulating layer on the wiring layer. The recessed region extends from a side surface of the device layer toward the device region. A first portion of the upper insulating layer covers the side surface of the wiring layer that is exposed by the recessed region.

公开(公告)号：US20210141014A1

公开(公告)日：2021-05-13

申请号：US16916679

申请日：2020-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chansik KWON ,  Junyoung KO ,  Jongkeun MOON ,  Jinduck PARK ,  Jiyeon HAN

IPC: G01R31/28 ,  H01L21/66

Abstract: A test apparatus includes a test chamber in which a plurality of the semiconductor packages having a plurality of component dies is secured, an operation tester configured to conduct an operation test to the plurality of semiconductor packages to detect whether at least one semiconductor package is an operation fault package having a fault and identify a fault package point at which the operation fault package is located, a fault heat detector configured to detect a fault heat generated from the fault, and a test controller configured to control the operation tester to conduct the operation test to the plurality of semiconductor packages and control the fault heat detector subsequent to the operation test to detect the fault heat generated from the fault of the operation fault package to determine a vertical point of the fault and to determine a fault die having the fault.

公开(公告)号：US20170005710A1

公开(公告)日：2017-01-05

申请号：US15100281

申请日：2014-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeyoung KIM ,  Jiyun SEOL ,  Chanhong KIM ,  Jaeyoel KIM ,  Hyunjung KIM ,  Inhak NA ,  Jiyeon HAN

IPC: H04B7/06 ,  H04B7/04

CPC classification number: H04B7/0417 ,  H04B7/0408 ,  H04B7/0456 ,  H04B7/0617 ,  H04B7/0619 ,  H04B7/0639 ,  H04B7/0669 ,  H04B7/0671 ,  H04B7/0691 ,  H04B7/088 ,  H04L5/0016 ,  H04L5/0023 ,  H04L5/0048 ,  H04W16/28

Abstract: A method for a transmitter of a mobile communication system transmitting and receiving signals according to an embodiment of the present specification comprises the steps of transmitting to a receiver system information for transmitting a signal to the receiver including a connection between a wireless resource and a transmitting antenna; transmitting a reference signal to the receiver based on the system information; and receiving from the receiver feedback information generated based on the reference signal. According to an embodiment of the present specification, in a beamforming transmission method of a mobile communication system, a transmitter can determine whether to perform digital pre-coding without advance information from a receiver and can consequently perform a transmission, and can thereby perform lower-overhead and efficient signal transmission/reception.

Abstract translation: 根据本说明书的实施例的用于发送和接收信号的移动通信系统的发射机的方法包括以下步骤：向接收机系统发送用于向接收机发送信号的信息，包括无线资源和发射天线之间的连接 ; 基于所述系统信息向所述接收机发送参考信号; 并从接收器接收基于参考信号产生的反馈信息。 根据本说明书的实施例，在移动通信系统的波束赋形传输方法中，发射机可以确定是否进行来自接收机的提前信息的数字预编码，从而能够进行传输， 开销高效的信号发送/接收。