公开(公告)号：US20240014060A1

公开(公告)日：2024-01-11

申请号：US18162182

申请日：2023-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daejung Kim ,  Minyoung Kang ,  Sungsoo Kim ,  Sohee Kim ,  Yongsoo Yoo ,  Jihyeon Ha

IPC: H01L21/677 ,  G01D5/24 ,  G01B21/24 ,  B25J9/16 ,  H01L27/146 ,  H01L21/68 ,  H01J37/32 ,  G06T7/00 ,  G06T7/73

CPC classification number: H01L21/67739 ,  G01D5/24 ,  G01B21/24 ,  B25J9/1697 ,  H01L27/14618 ,  H01L21/681 ,  H01J37/32715 ,  G06T7/001 ,  G06T7/74 ,  H01L21/68707

Abstract: A sensor module includes a body including a first body part and a second body part detachably coupled to the first body part, a first sensor unit on a lower surface of the body, and configured to detect a contact area in which the lower surface of the body contacts a first external object and to output a first measurement value, a second sensor unit on a side surface of the body and configured to output a second measurement value by measuring a distance between the side surface of the body and a second external object, and a control circuit in the body part configured to control the first sensor unit and the second sensor unit and generate measurement data based on the first measurement value and the second measurement value. The first sensor unit and the second sensor unit are in the second body part.

公开(公告)号：US12172313B2

公开(公告)日：2024-12-24

申请号：US17957967

申请日：2022-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daejung Kim ,  Minyoung Kang ,  Sungsoo Kim ,  Sohee Kim ,  Yongsoo Yoo

IPC: B25J9/16 ,  B25J11/00 ,  B25J19/02

Abstract: A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first image, identifying particle patterns formed on the lower surface of the substrate in the substrate processing process, and an edge of the substrate, from the first image, calculating a first alignment error value of a deviation between an approximate position value for the center of the loading region calculated from the particle patterns and an approximate position value for a center of the substrate calculated from the edge of the substrate, and determining a point in time for teaching a transfer robot that deposits the substrate into the chamber, based on the first alignment error value.