公开(公告)号：US20230257884A1

公开(公告)日：2023-08-17

申请号：US18137062

申请日：2023-04-20

Applicant: SAMSUNG ELECTRONICS CO, LTD. ,  INTOPS CO, LTD.

Inventor： Chunghyo JUNG ,  Wonjun KO ,  Hyein PARK ,  Yongsub LEE ,  Jaedeok LIM ,  Bumjin CHO ,  Chiyoung YOON ,  Keunha KIM ,  Kyungha KOO ,  Hongki MOON

IPC: C23C18/20 ,  H05K5/02 ,  B23C3/30 ,  C23C18/16

CPC classification number: C23C18/2013 ,  H05K5/0247 ,  B23C3/30 ,  C23C18/1651 ,  C23C18/1689 ,  B23K26/364

Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

公开(公告)号：US20200350660A1

公开(公告)日：2020-11-05

申请号：US16861800

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegyu KIM ,  Kyungbae KO ,  Un KIM ,  Sanguk KIM ,  Donghwan KIM ,  Yongsub LEE

IPC: H01Q1/24 ,  H05K5/00 ,  H05K5/02 ,  H05K7/14 ,  H05K1/02 ,  H01Q1/50 ,  H01Q5/20 ,  H01Q9/04 ,  H01Q1/48

Abstract: An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.