公开(公告)号：US20240363625A1

公开(公告)日：2024-10-31

申请号：US18422471

申请日：2024-01-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Beom Jin Park ,  Myung Gil Kang ,  Dong Won Kim ,  Young Gwon Kim ,  Soo Jin Jeong

IPC: H01L27/088 ,  H01L29/06 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L27/088 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device is provided. The semiconductor includes a substrate having a first conductivity type; a well region having a second conductivity type in the substrate; an impurity implantation region having the first conductivity type in the well region; an element separation pattern in the substrate; a first fin pattern defined by the element separation pattern in the impurity implantation region; a second fin pattern defined by the element separation pattern in the well region; and a third fin pattern defined by the element separation pattern in the substrate, wherein the first fin pattern is a single fin, and an entirety of a lower boundary of the impurity implantation region is in contact with the well region.