公开(公告)号：US20140048477A1

公开(公告)日：2014-02-20

申请号：US14061203

申请日：2013-10-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyo KANG ,  Sung Soo HAN ,  Pil Jin YOO ,  Du-yeol RYU ,  Young Hun KIM ,  Seon Ju YEO

IPC: C02F1/44

CPC classification number: C02F1/44 ,  B01D67/0006 ,  B01D67/0009 ,  B01D67/003 ,  B01D67/0058 ,  B01D67/0079 ,  B01D67/0088 ,  B01D67/0093 ,  B01D69/02 ,  B01D69/10 ,  B01D69/12 ,  B01D69/125 ,  B01D69/148 ,  B01D71/021 ,  B01D71/024 ,  B01D71/028 ,  B01D71/80 ,  B01D2323/28 ,  B01D2323/283 ,  B01D2323/46 ,  B01D2325/021 ,  B01D2325/08 ,  B01D2325/12 ,  B01D2325/24 ,  B29C67/202

Abstract: A hybrid porous structured material may include a matrix including a plurality of first pores interconnected in three dimensions, and a porous material including second pores and filling wholly or partially each of the plurality of the first pores.

Abstract translation: 混合多孔结构材料可以包括包括在三维中互连的多个第一孔的基质和包含第二孔并且全部或部分地填充多个第一孔中的每一个的多孔材料。

公开(公告)号：US20240128098A1

公开(公告)日：2024-04-18

申请号：US18216675

申请日：2023-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Hun KIM

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/683

CPC classification number: H01L21/67132 ,  B65G47/90 ,  H01L21/6836

Abstract: A semiconductor manufacturing equipment includes: a first clamp fixing a dicing tape, on which a plurality of divided dies are disposed, and configured to ascend and descend; and a first expander adjacent to the first clamp and including a body, a first protrusion connected to the body, and a second protrusion connected to the body and spaced apart from the first protrusion, wherein, when no pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion protrude from the body, and wherein, when a pressure is exerted on the first protrusion and the second protrusion, the first protrusion and the second protrusion descend into the body depending on a magnitude of the pressure exerted on the first protrusion and the second protrusion.