公开(公告)号：US10582257B2

公开(公告)日：2020-03-03

申请号：US15441395

申请日：2017-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-gu Lee ,  Yeon-woo Kim ,  Young-jin Lee ,  Jae-hyun Lee

IPC: H04N21/438 ,  H04N21/462 ,  H04N21/426

Abstract: Provided is an image display apparatus including: a communicator configured to receive, from a server, information about an integrated frequency band corresponding to a region where the image display apparatus is located; a display; a processor; a memory; and at least one program stored in the memory and executed by the processor, wherein the at least one program comprises instructions for scanning channels included in the integrated frequency band for a channel receivable by the image display apparatus, and displaying a result of the scanning on the display, and the integrated frequency band is a frequency band determined based on frequency bands receivable by other image display apparatuses located in the same region as the image display apparatus.

公开(公告)号：US10270513B2

公开(公告)日：2019-04-23

申请号：US15653732

申请日：2017-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-jong Shin ,  Byung-ju Kwak ,  Young-jin Lee ,  Jun-seok Kang ,  Chang-hyo Kim ,  Kyoung-seok Noh ,  Dong-jin Park

IPC: H04B7/08 ,  H04H40/18 ,  H04N5/455 ,  H04N5/52 ,  H04N21/438

Abstract: A broadcast receiving apparatus is provided, which includes an input that receives input signals, a signal processing unit which amplifies only a signal in a band that corresponds to a selected channel from among the input signals, and automatic gain controls with a first sensitivity so that the amplified signal maintains a preset level value, and then outputs the result, a demodulator which demodulates the signals output from the signal processing unit into digital transport stream signals, a controller configured to control the signal processing unit so that the signal is automatic gain controlled with a second sensitivity less sensitive than the first sensitivity, when the selected channel is an ultra high frequency (UHF) range signal.

公开(公告)号：US10153855B2

公开(公告)日：2018-12-11

申请号：US15456764

申请日：2017-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-jin Park ,  Jun-Seok Kang ,  Chang-hyo Kim ,  Kyoung-seok Noh ,  Sung-ki Son ,  Hyun-jong Shin ,  Young-jin Lee

IPC: H04B1/06 ,  H04H60/32 ,  H03G3/30 ,  H04L27/00

Abstract: Disclosed is a broadcast receiver that includes an antenna connector configured to connect with an antenna for receiving a broadcast signal including broadcast content. The broadcast receiver also includes a signal processor configured to generate a reference signal having a strength corresponding to a signal input through the antenna connector and to process the generated reference signal to output an image signal for displaying the broadcast content, and a controller configured to determine whether the antenna is connected to the antenna connector based on an output value of the reference signal and to perform subsequent operations related to whether the antenna is connected based on the determination.

公开(公告)号：US09099332B2

公开(公告)日：2015-08-04

申请号：US14137885

申请日：2013-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

IPC: H05B37/00 ,  H05B39/00 ,  H05B41/00 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/075 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

Abstract translation: 用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备。 所述引线框架包括多个安装部分，所述多个安装部分安装有多个发光器件芯片; 用于电路连接多个发光器件芯片的多个连接部分; 从所述多个连接部分延伸的端子部分。 发光器件封装通过将多个发光器件芯片直接安装在引线框架上并将安装的发光器件芯片封装在引线框架上而形成。 引线框架包括用于电路连接多个发光器件芯片的多个连接部分和其一部分电路暴露的端子部分。