SOLDER BALL ATTACHING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240071983A1

    公开(公告)日:2024-02-29

    申请号:US18227697

    申请日:2023-07-28

    CPC classification number: H01L24/75 B23K3/0623 H01L2224/75804

    Abstract: A solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. The working die may be provided with an upper plate on which the lifting members are installed. The upper plate may be provided with an insertion groove, into which an upper end portion of the lifting member is inserted when the lifting member is lowered, and a locking groove into which a lower end portion of the lifting member is inserted when the lifting member is raised. The lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed.

    OPERATING METHOD OF STORAGE CONTROLLER, STORAGE DEVICE, AND OPERATING METHOD OF STORAGE DEVICE

    公开(公告)号:US20250086113A1

    公开(公告)日:2025-03-13

    申请号:US18794433

    申请日:2024-08-05

    Abstract: An operating method of a storage controller includes, storing data and a source type of the data in a cache memory, when a cache hit occurs, determining a source type of data corresponding to the cache hit and updating a hit count corresponding to the determined source type among a plurality of hit counts, determining a source type with a dominant hit rate among a plurality of source types based on the plurality of hit counts, operating in a first mode when a result of the determining indicates that the source type with the dominant hit rate is a first type, and operating in a second mode when the result of the determining indicates that the source type with the dominant hit rate is a second type.

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