公开(公告)号：US20240071983A1

公开(公告)日：2024-02-29

申请号：US18227697

申请日：2023-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongken YU ,  Cheolsoo HAN ,  Kwangjin BAE ,  Youngjin JANG ,  Inwook JUNG ,  Minchul CHO

IPC: H01L23/00 ,  B23K3/06

CPC classification number: H01L24/75 ,  B23K3/0623 ,  H01L2224/75804

Abstract: A solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. The working die may be provided with an upper plate on which the lifting members are installed. The upper plate may be provided with an insertion groove, into which an upper end portion of the lifting member is inserted when the lifting member is lowered, and a locking groove into which a lower end portion of the lifting member is inserted when the lifting member is raised. The lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed.

公开(公告)号：US20240023346A1

公开(公告)日：2024-01-18

申请号：US18166322

申请日：2023-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghun CHEONG ,  Minchul CHO ,  Cheolsoo HAN

IPC: H10B80/00 ,  H01L23/00

CPC classification number: H10B80/00 ,  H01L24/45 ,  H01L24/48 ,  H01L24/32 ,  H01L24/33 ,  H01L23/564 ,  H01L24/83 ,  H01L24/85 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45147 ,  H01L2224/45124 ,  H01L2224/45184 ,  H01L2224/45155 ,  H01L2224/4518 ,  H01L2224/45144 ,  H01L2224/45139 ,  H01L2224/45171 ,  H01L2224/45111 ,  H01L2224/45166 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/85007 ,  H01L2224/92147

Abstract: A semiconductor package includes a package substrate, a plurality of first semiconductor chips stacked on an upper surface of the package substrate in a stair-step configuration, the plurality of first semiconductor chips having an uppermost semiconductor chip at a first height from the upper surface of the package substrate, the uppermost semiconductor chip including a free end portion. Conductive wires respectively electrically connect chip pads of the first semiconductor chips to substrate pads of the package substrate. A plurality of first support structures each have a first end attached to the upper surface of the package substrate and an opposite second end attached to the free end portion of the uppermost semiconductor chip. The first support structures are inclined at an angle relative to the package substrate.