-
1.
公开(公告)号:US20230049882A1
公开(公告)日:2023-02-16
申请号:US17818080
申请日:2022-08-08
发明人: Jungho Do , Jisu Yu , Hyeongyu You , Minjae Jeong , Yujin Pyo
IPC分类号: G06F30/392 , G06F30/394
摘要: An integrated circuit includes a plurality of standard cells including first and second standard cells arranged adjacent to each other in a first direction, and first, second, and third metal layers sequentially stacked in a vertical direction. At least one power segment is arranged adjacent a region where at least one of the first standard cell and the second standard cell is arranged. The at least one power segment is configured to provide power to the plurality of standard cells and is formed as a pattern of the third metal layer extending in a second direction.