公开(公告)号：US10177188B2

公开(公告)日：2019-01-08

申请号：US15583224

申请日：2017-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Yungcheol Kong ,  Hyunsu Jun ,  Kyoungsei Choi

IPC: H01L27/146 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/024

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

公开(公告)号：US11949975B2

公开(公告)日：2024-04-02

申请号：US16844398

申请日：2020-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghak Lee ,  Gunwoo Ryu ,  Euncheol Lee ,  Hyunsu Jun

IPC: H04N23/57 ,  H04N5/953 ,  H04N23/40 ,  H04N23/55

CPC classification number: H04N23/57 ,  H04N5/953 ,  H04N23/40 ,  H04N23/55

Abstract: Provided are a camera module and an imaging apparatus including the same. The camera module includes a printed circuit board (PCB); a first imaging device on the PCB, the first imaging device configured to generate first image data based on a received optical signal; a second imaging device on the PCB, the second imaging device configured to generate second image data based on the received optical signal; a power management integrated circuit (PMIC) on the PCB, the PMIC configured to generate a plurality of power voltages based on an external power voltage received from an external power supply and provide the plurality of power voltages to the first imaging device and the second imaging device; and a connector configured to receive the external power voltage from the external power supply and provide the external power voltage to the PMIC.

公开(公告)号：US11563874B2

公开(公告)日：2023-01-24

申请号：US17570500

申请日：2022-01-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsu Jun ,  Kihyun Kwon ,  Seunghak Lee

IPC: H04N5/225

Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.

公开(公告)号：US11482554B2

公开(公告)日：2022-10-25

申请号：US16898610

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Yungcheol Kong ,  Hyunsu Jun ,  Kyoungsei Choi

IPC: H01L27/146 ,  H01L31/0203 ,  H01L23/00 ,  H01L31/024

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.

公开(公告)号：US09966401B2

公开(公告)日：2018-05-08

申请号：US15049002

申请日：2016-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Jun

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor package according to the inventive concepts includes an image sensor chip mounted on a substrate, a first holder disposed on an edge area of the image sensor chip, a second holder disposed laterally spaced apart from the image sensor chip on an edge area of the substrate, a molding part provided in a gap region between the first holder and the second holder on the substrate, and a transparent cover disposed on the first holder and the molding part.

公开(公告)号：US09634046B2

公开(公告)日：2017-04-25

申请号：US14685898

申请日：2015-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Jun

IPC: H01L27/146 ,  H01L23/538 ,  H01L23/04 ,  H01L27/02 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L27/146 ,  H01L23/04 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5386 ,  H01L24/97 ,  H01L27/0248 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package can include a substrate and a semiconductor chip inside the semiconductor package mounted on the substrate. A first conductive pattern can be on the substrate inside the semiconductor package and can be electrically connected to an input/output of the semiconductor chip. A holder can be on the substrate, where the holder can be configured to provide a recess in which the semiconductor chip is located. An electrically insulating adhesive layer can be configured to electrically insulate the first conductive pattern from an Electric Static Discharge (ESD) source located outside the semiconductor package and configured to adhere the holder to the substrate.

公开(公告)号：US20220021794A1

公开(公告)日：2022-01-20

申请号：US17336931

申请日：2021-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsu Jun ,  Kihyun Kwon ,  Seunghak Lee

IPC: H04N5/225

Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.

公开(公告)号：US11218651B2

公开(公告)日：2022-01-04

申请号：US16786472

申请日：2020-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-Sang Song ,  Hyunsu Jun

IPC: H04N5/33

Abstract: An image sensor chip includes a substrate; an image sensor chip provided on the substrate; and an adhesive film provided between the image sensor chip and the substrate in a semi-cured state. A first width of the adhesive film is equal to a second width of the image sensor chip.

公开(公告)号：US11086099B2

公开(公告)日：2021-08-10

申请号：US16834583

申请日：2020-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihyung Lim ,  Seunghak Lee ,  Hyunsu Jun

IPC: H04N5/225 ,  G02B7/09 ,  G02B13/00

Abstract: A light-folding camera includes a light folding device, a light path control device LPC, a first sensor and a second sensor. The light folding device outputs a folded light propagating in a first horizontal direction substantially perpendicular to a vertical direction by changing a light path of a vertical light that is incident on the light folding device in the vertical direction. The light path control device outputs a first light propagating in the first horizontal direction by passing at least a first portion of the folded light, or outputs a second light propagating in a second horizontal direction substantially perpendicular to the vertical direction by changing a light path of at least a second portion of the folded light. The first sensor receives the first light propagating in the first horizontal direction. The second sensor receives the second light propagating in the second horizontal direction.

公开(公告)号：US20190074316A1

公开(公告)日：2019-03-07

申请号：US16177780

申请日：2018-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung KANG ,  Yungcheol Kong ,  Hyunsu Jun ,  Kyoungsei Choi

IPC: H01L27/146 ,  H01L31/024 ,  H01L31/0203 ,  H01L23/00

Abstract: A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.