公开(公告)号：US20250132185A1

公开(公告)日：2025-04-24

申请号：US18825121

申请日：2024-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghwa Kim ,  Daeho Min ,  Yunha Kim ,  Kwanghyun Cho ,  Kyeongbin Lim

IPC: H01L21/683 ,  H01L21/67

Abstract: A cooling system for semiconductor equipment includes a chamber, an electrostatic chuck in the chamber, a coolant pipe housing in at least one of the chamber and the electrostatic chuck, the coolant pipe housing having an internal space, a coolant pipe at least partially in the internal space of the coolant pipe housing, and a flow controller configured to control a flow velocity of the coolant flowing along the coolant pipe so that the flow velocity periodically reaches a highest speed and a lowest speed.

公开(公告)号：US20250149317A1

公开(公告)日：2025-05-08

申请号：US18658293

申请日：2024-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunha Kim ,  Kwanghyun Cho ,  Jonghwa Kim ,  Sanghoon Kim ,  Hansung Cho

IPC: H01J37/32

Abstract: A method of controlling a physical quantity of a semiconductor manufacturing facility includes performing feedforward control including control of a first stage feedforward to accelerate a physical quantity control system to a physical limit performance and control of a second stage feedforward to reduce acceleration of the physical quantity control system at a first switching point, switching the feedforward control to feedback control at a second switching point, and performing feedback control on the physical quantity control system.