公开(公告)号：US20200037460A1

公开(公告)日：2020-01-30

申请号：US16522896

申请日：2019-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjung JEONG ,  Youngsoo JANG ,  Yunsung HA ,  Yongwook HWANG ,  Changyoun HWANG

IPC: H05K7/02 ,  G06F1/16 ,  G06F1/18 ,  H01M2/10 ,  H04M1/02

Abstract: A device, a house for the device and a method are disclosed herein. The device includes a first plate, a second plate facing an opposite direction, a side member integrally formed with the second plate, surrounding a space between the first the second plate, and a mid-plate coupled to the side member, extending into the space, the side member further including an aluminum substrate layer formed between a first and second surface exposed within the space, an aluminum oxide layer formed between the first surface and the aluminum substrate layer including multiple pores, a first layer formed conformally between the first surface and the aluminum oxide layer along the multiple pores and a surface of the aluminum oxide layer, the first layer comprising titanium, and a second layer formed on the first layer as to form the first surface, the second layer comprising titanium.

公开(公告)号：US20190222683A1

公开(公告)日：2019-07-18

申请号：US16249498

申请日：2019-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byounghee CHOI ,  Jihyun KIM ,  Minsung LEE ,  Jinho LEE ,  Youngsoo JANG ,  Yunsung HA ,  Yongwook HWANG ,  Junghyeon HWANG ,  Changyoun HWANG ,  Minwoo YOO

IPC: H04M1/18 ,  G06F1/16 ,  H04M1/02 ,  H01Q1/24 ,  H04B1/3888 ,  H05K5/00 ,  H05K5/02

CPC classification number: H04M1/18 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1698 ,  H01Q1/243 ,  H04B1/3888 ,  H04M1/0202 ,  H04M1/0249 ,  H05K5/0086 ,  H05K5/0247

Abstract: An electronic device is provided. The electronic device includes a frame structure, and the frame structure includes an outer metallic portion including a first metallic material and forming at least a portion of an outer surface of the electronic device, and an inner metallic portion including a second metallic material different from the first metallic material and laterally surrounded by the outer metallic portion, and a first inner polymeric portion isolated from the inner metallic portion and at least partially laterally surrounded by the outer metallic portion. The electronic device includes a wireless communication circuit electrically connected to a portion of the outer metallic portion.