公开(公告)号：US20230146095A1

公开(公告)日：2023-05-11

申请号：US17421143

申请日：2021-07-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung KIM ,  Hyeonjeong KIM

IPC: G06F21/32 ,  G06F9/451

CPC classification number: G06F21/32 ,  G06F9/453

Abstract: According to various embodiments, an electronic device comprising a memory; a communication module; and a processor, operatively connected to the memory and the communication module, and configured to, if a locked state of the electronic device and a first state of the electronic device are identified, when a first user utterance is acquired that requests a task executable in an unlocked state of the electronic device, change an unlocking type of the electronic device to an unlocking type of an external device, based on first information of the external device, the external device being communicatively connected to the electronic device through the communication module, unlock the electronic device, which is configured with the unlocking type of the external device, based on user authentication information acquired from the external device, and execute the task corresponding to the first user utterance. Various other embodiments may be provided. Meanwhile, a method of performing an authentication operation by the electronic device may be performed using an artificial intelligence model.

公开(公告)号：US20230031966A1

公开(公告)日：2023-02-02

申请号：US17889768

申请日：2022-08-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjeong KIM

IPC: G10L15/22 ,  G10L15/26

Abstract: An electronic device is provided. The electronic device includes a processor and a memory storing instructions which, when executed by the processor, cause the processor to obtain information of a wireless audio device wirelessly connectable to the electronic device, determine whether an utterance of a user is a device-controlling utterance for a target device which is a target of remote control in response to the information of the wireless audio device, and suggest switching a connection of the wireless audio device to the target device based on an intent in the utterance of the user. Other example embodiments, in addition to the foregoing example embodiment, are also applicable.

公开(公告)号：US20220415325A1

公开(公告)日：2022-12-29

申请号：US17901038

申请日：2022-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungyup LEE ,  Hyeonjeong KIM ,  Jaehwan LEE

IPC: G10L15/22 ,  G10L15/20

Abstract: An electronic device and method are disclosed herein. The electronic device includes a communication circuit, a processor, and a memory. The processor implements the method, including: receiving, from each of one or more external devices receiving a voice signal of a user, via the communication circuit, a first probability value based on usage frequency, and a second probability value based on signal-to-noise (SNR) magnitude, calculating final probability values for each of the one or more external devices, based on respective first and second probability values of each of the one or more external devices, and selecting an external device from among the one or more external devices having a highest final probability value from among the calculated final probability values.

公开(公告)号：US20240153919A1

公开(公告)日：2024-05-09

申请号：US18451197

申请日：2023-08-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjeong KIM ,  Jongmin LEE ,  Jimin CHOI

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3142 ,  H01L24/08 ,  H01L24/09 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/08113 ,  H01L2224/0903 ,  H01L2224/16148 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1436

Abstract: A semiconductor package includes a first semiconductor chip including a circuit layer on a first substrate, first through silicon vias passing through the first substrate, first lower bump pads on the circuit layer, and a first upper bump pad and a second upper bump pad on a second surface of the first substrate, each of the first upper bump pad and the second upper bump pad connected to a corresponding one of the first through silicon vias. The package includes a second semiconductor chip including a circuit layer on a first surface of a second substrate, and second lower bump pads on the circuit layer on the second substrate. The package includes a first solder bump to bond the first upper bump pad and the second lower bump pad, and a plurality of second solder bumps to bond the second upper bump pad and the second lower bump pads.

公开(公告)号：US20230142110A1

公开(公告)日：2023-05-11

申请号：US17420926

申请日：2021-06-29

Applicant: Samsung Electronics Co.,Ltd.

Inventor： Hyeonjeong KIM ,  Seungyup LEE ,  Soyoung KIM

IPC: G10L15/22 ,  G10L15/18 ,  G06F3/16 ,  G10L15/30

CPC classification number: G10L15/22 ,  G10L15/1815 ,  G06F3/167 ,  G10L15/30 ,  G10L2015/223

Abstract: A user terminal device includes a display; at least one sensor; a communication module; and a processor operatively connected to the display, the at least one sensor, and the communication module, wherein the processor is configured to, based on receiving a user utterance voice, determine whether or not a response screen corresponding to the user utterance voice is able to be provided through the display on the basis of at least one of a sensed value obtained from the at least one sensor or an inactive period of the display, based on determining that the response screen is unable to be provided through the display, receive current status information of at least one external device connected to the user terminal device through the communication module, determine one external device among the at least one external device to display the response screen on the basis of the current status information of the at least one external device, obtain the response screen to the user utterance voice, and transmit the response screen to the one external device through the communication module.

公开(公告)号：US20220415323A1

公开(公告)日：2022-12-29

申请号：US17867280

申请日：2022-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeonjeong KIM

IPC: G10L15/22 ,  H04W4/80 ,  G10L15/26 ,  H04W4/02

Abstract: According to an example embodiment, an electronic device includes: a memory storing instructions and a processor electrically connected to the memory and configured to execute the instructions. The instructions, when executed by the processor, cause the processor to: determine whether an utterance is a device-controlling utterance for a target device to be remotely controlled, verify a distance between the electronic device and the target device based on the utterance being the device-controlling utterance, and output an object generated differently based on whether the distance is a short distance less than or equal to a specified distance or a long distance greater than the specified distance.

公开(公告)号：US20220180870A1

公开(公告)日：2022-06-09

申请号：US17535831

申请日：2021-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjeong KIM ,  Soyoung KIM ,  Taegu KIM ,  Yoonju LEE

IPC: G10L15/22 ,  G06F3/16

Abstract: An electronic device is provided. The electronic device includes a voice input device, a communication circuit, a display, a processor operatively connected to the voice input device, the communication circuit, and the display, and a memory operatively connected to the processor. The memory may store one or more instructions that, when executed, cause the processor to receive a first utterance from a first user through the voice input device, to communicatively connect to a first external electronic device based on the first utterance, to display, to the display, a first user interface indicating a state of communicatively connecting to the first external electronic device, and to display, to the display, a second user interface indicating that the electronic device and the second external electronic device are simultaneously connected to the first external electronic device when the first external electronic device is communicatively connected to a second external electronic device.