公开(公告)号：US12114435B2

公开(公告)日：2024-10-08

申请号：US17744291

申请日：2022-05-13

申请人： Sandisk Technologies, Inc.

发明人： Virgil Zhu ,  Vincent Jiang ,  Paul Qu ,  Shixing Zhu ,  Yuanheng Zhang ,  Enoch He ,  Yonglong Liu ,  Lian Chen ,  Guangqiang Li ,  Jingyun Chen

IPC分类号： B23K1/00 ,  B23K3/00 ,  B23K37/04 ,  H05K3/34 ,  B23K101/42

CPC分类号： H05K3/3494 ,  B23K1/0016 ,  B23K37/04 ,  H05K3/341 ,  H05K3/3457 ,  B23K2101/42

摘要： A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.