公开(公告)号：US20120189963A1

公开(公告)日：2012-07-26

申请号：US13171623

申请日：2011-06-29

申请人： Sang Wook PARK ,  So Jung PARK ,  Dong Chul SEO

发明人： Sang Wook PARK ,  So Jung PARK ,  Dong Chul SEO

IPC分类号： G03F7/20 ,  C08K5/05

CPC分类号： G03F7/405 ,  C08F220/56 ,  C08F220/58 ,  C08F220/60 ,  C08F232/08 ,  C08F2220/281 ,  C08F2220/282

摘要： A water-soluble resin composition for forming fine patterns comprising water-soluble polymer represented by Chemical Formula 1 as below and the first water-soluble solvent, is coated and heated on a photoresist layer having at least one contact hole to reduce a size of the at least one contact hole. (In Chemical Formula 1, each of R1, R2, R3 and R5 independently represents an alkyl group of C1-30 or an cyclo alkyl group of C3-30 which respectively have one selected from the group consisting of hydrogen, an ether group, an ester group, a carbonyl group, an acetal, an epoxy group, a nitril group, an amine group, and an aldehyde group; each of R4, R6, R7 and R8 independently represents hydrogen or a methyl group; n represents an integer of 0 to 5; a represents a real number of 0.05 to 0.5; each of b, c and d respectively represents a real number of 0 to 0.7; and a+b+c+d=1)

摘要翻译： 用于形成包含如下化学式1所示的水溶性聚合物的精细图案的水溶性树脂组合物和第一水溶性溶剂在具有至少一个接触孔的光致抗蚀剂层上被涂覆和加热，以减小 至少一个接触孔。 （在化学式1中，R1，R2，R3和R5各自独立地表示C1-30的烷基或C3-30的环烷基，其分别具有选自氢，醚基， 酯基，羰基，缩醛，环氧基，腈基，胺基和醛基; R 4，R 6，R 7和R 8各自独立地表示氢或甲基; n表示0 至5; a表示0.05至0.5的实数; b，c和d分别表示0至0.7的实数; a + b + c + d = 1）