Water-soluble resin composition and method of forming fine patterns by using the same
    1.
    发明授权
    Water-soluble resin composition and method of forming fine patterns by using the same 失效
    水溶性树脂组合物及使用其形成精细图案的方法

    公开(公告)号:US08765358B2

    公开(公告)日:2014-07-01

    申请号:US13171623

    申请日:2011-06-29

    摘要: A water-soluble resin composition for forming fine patterns comprising water-soluble polymer represented by Chemical Formula 1 as below and the first water-soluble solvent, is coated and heated on a photoresist layer having at least one contact hole to reduce a size of the at least one contact hole. (In Chemical Formula 1, each of R1, R2, R3 and R5 independently represents an alkyl group of C1-30 or an cyclo alkyl group of C3-30 which respectively have one selected from the group consisting of hydrogen, an ether group, an ester group, a carbonyl group, an acetal, an epoxy group, a nitril group, an amine group, and an aldehyde group; each of R4, R6, R7 and R8 independently represents hydrogen or a methyl group; n represents an integer of 0 to 5; a represents a real number of 0.05 to 0.5; each of b, c and d respectively represents a real number of 0 to 0.7; and a+b+c+d=1).

    摘要翻译: 用于形成包含如下化学式1所示的水溶性聚合物的精细图案的水溶性树脂组合物和第一水溶性溶剂在具有至少一个接触孔的光致抗蚀剂层上被涂覆和加热,以减小 至少一个接触孔。 (在化学式1中,R1,R2,R3和R5各自独立地表示C1-30的烷基或C3-30的环烷基,其分别具有选自氢,醚基, 酯基,羰基,缩醛,环氧基,腈基,胺基和醛基; R 4,R 6,R 7和R 8各自独立地表示氢或甲基; n表示0 至5; a表示0.05至0.5的实数; b,c和d分别表示0至0.7的实数; a + b + c + d = 1)。

    WATER-SOLUBLE RESIN COMPOSITION AND METHOD OF FORMING FINE PATTERNS BY USING THE SAME
    2.
    发明申请
    WATER-SOLUBLE RESIN COMPOSITION AND METHOD OF FORMING FINE PATTERNS BY USING THE SAME 失效
    水溶性树脂组合物及其使用形成细小图案的方法

    公开(公告)号:US20120189963A1

    公开(公告)日:2012-07-26

    申请号:US13171623

    申请日:2011-06-29

    IPC分类号: G03F7/20 C08K5/05

    摘要: A water-soluble resin composition for forming fine patterns comprising water-soluble polymer represented by Chemical Formula 1 as below and the first water-soluble solvent, is coated and heated on a photoresist layer having at least one contact hole to reduce a size of the at least one contact hole. (In Chemical Formula 1, each of R1, R2, R3 and R5 independently represents an alkyl group of C1-30 or an cyclo alkyl group of C3-30 which respectively have one selected from the group consisting of hydrogen, an ether group, an ester group, a carbonyl group, an acetal, an epoxy group, a nitril group, an amine group, and an aldehyde group; each of R4, R6, R7 and R8 independently represents hydrogen or a methyl group; n represents an integer of 0 to 5; a represents a real number of 0.05 to 0.5; each of b, c and d respectively represents a real number of 0 to 0.7; and a+b+c+d=1)

    摘要翻译: 用于形成包含如下化学式1所示的水溶性聚合物的精细图案的水溶性树脂组合物和第一水溶性溶剂在具有至少一个接触孔的光致抗蚀剂层上被涂覆和加热,以减小 至少一个接触孔。 (在化学式1中,R1,R2,R3和R5各自独立地表示C1-30的烷基或C3-30的环烷基,其分别具有选自氢,醚基, 酯基,羰基,缩醛,环氧基,腈基,胺基和醛基; R 4,R 6,R 7和R 8各自独立地表示氢或甲基; n表示0 至5; a表示0.05至0.5的实数; b,c和d分别表示0至0.7的实数; a + b + c + d = 1)

    Polymer and chemically amplified resist composition containing the same
    4.
    发明授权
    Polymer and chemically amplified resist composition containing the same 有权
    含有其的聚合物和化学放大抗蚀剂组合物

    公开(公告)号:US07285373B2

    公开(公告)日:2007-10-23

    申请号:US10940469

    申请日:2004-09-14

    IPC分类号: G03F7/039

    摘要: A chemically amplified resist composition includes a novel polymer, a photoacid generator, and a solvent.The chemically amplified resist can form a resist pattern that is excellent in adhesiveness with a low dependency to the substrate, transparency at the far ultraviolet wavelength range such as KrF Excimer laser or ArF Excimer laser, dry etch resistance, sensitivity, resolution, and developability. In addition, the polymer contains a maximum number of saturated aliphatic rings to enhance etching resistance, and additionally includes an alkoxyalkyl acrylate monomer introduced as a solution to the problem with the conventional polyacrylate resist in regard to edge roughness of the pattern, to form a uniform edge of the pattern because the alkylalcohol compound generated together with a formaldehyde and a carboxylate compound by a deprotection reaction of the alkoxyalkyl acrylate monomer with an acid acts as a solvent or an antifoaming agent in the pattern.

    摘要翻译: 化学放大抗蚀剂组合物包括新型聚合物,光致酸产生剂和溶剂。 化学放大抗蚀剂可以形成粘合性优异,对基板的依赖性低,抗紫外波长范围如KrF准分子激光器或ArF准分子激光器的透光性,耐干蚀刻性,灵敏度,分辨率和显影性。 此外,聚合物含有最大数量的饱和脂肪族环,以提高耐蚀刻性,并且还包括作为溶液的烷基烷基酯单体引入的常规聚丙烯酸酯抗蚀剂相对于图案的边缘粗糙度的问题,形成均匀的 由于通过丙烯酸烷氧基烷基酯单体与酸的脱保护反应与甲醛和羧酸酯化合物一起产生的烷基醇化合物作为图案中的溶剂或消泡剂,因此图案的边缘。

    Sulfonium salt and its manufacturing method
    6.
    发明授权
    Sulfonium salt and its manufacturing method 有权
    锍盐及其制造方法

    公开(公告)号:US6111143A

    公开(公告)日:2000-08-29

    申请号:US140955

    申请日:1998-08-27

    CPC分类号: C07C381/12 Y02P20/55

    摘要: This invention relates to a sulfonium salt, including its manufacturing method, which is effectively used as a photoacid initiator or radical photoinitiator during polymerization and a photoacid generator, leaving the protection groups of organic compounds, especially as an useful photoacid generator of the chemically amplified photoresist employed in semiconductor materials. Since the sulfonium salt of this invention, so prepared via one-step reaction between sulfoxide compound and aromatic compound in the presence of perfluoroalkanesulfonic anhydride, has the advantages in that by overcoming some shortcomings of the prior art to prepare the sulfonium salt via two steps using Grinard reagent, this invention may provide a novel sulfonium salt with higher yield which cannot be achieved in the prior art and also to prepare even any conventional sulfonium salt having better yield.

    摘要翻译: 本发明涉及一种锍盐,包括其制造方法,其在聚合期间有效地用作光酸引发剂或自由基光引发剂,并且光酸产生剂,留下有机化合物的保护基团,特别是作为化学放大光致抗蚀剂的有用的光致酸产生剂 半导体材料。 由于在全氟烷基磺酸酐存在下通过亚砜化合物和芳族化合物之间的一步反应制备的本发明的锍盐的优点在于克服现有技术的一些缺点,通过两步使用 格林纳特试剂,本发明可以提供一种在现有技术中无法实现的更高产率的新型锍盐,并且甚至制备任何具有较好产率的常规锍盐。

    Photoacid generator, method for producing the same, and resist composition comprising the same
    7.
    发明授权
    Photoacid generator, method for producing the same, and resist composition comprising the same 有权
    光生酸产生剂,其制备方法和含有它的抗蚀剂组合物

    公开(公告)号:US08617789B2

    公开(公告)日:2013-12-31

    申请号:US13367896

    申请日:2012-02-07

    IPC分类号: C07C69/76 G03F7/004

    摘要: A photoacid generator represented by the following formula (1), a method for producing the photoacid generator, and a resist composition containing the photoacid generator are provided. wherein in the formula (1), Y1, Y2, X, R1, R2, n1, n2 and A+ have the same meanings as defined in the detailed description of the invention. The photoacid generator can maintain an appropriate contact angle at the time of ArF liquid immersion lithography, can reduce defects occurring during liquid immersion lithography, and has excellent solubility in resist solvents and excellent compatibility with resins. Furthermore, the photoacid generator can be produced by an efficient and simple method using an epoxy compound that is industrially easily available.

    摘要翻译: 提供由下式(1)表示的光致酸发生剂,光酸产生剂的制造方法和含有光酸产生剂的抗蚀剂组合物。 其中,在式(1)中,Y1,Y2,X,R1,R2,n1,n2和A +具有与本发明的详细说明中所定义的相同的含义。 光致酸发生器可以在ArF液浸光刻时保持适当的接触角,可以减少液浸光刻过程中发生的缺陷,并且在抗蚀剂溶剂中具有优异的溶解性和与树脂的相容性优异。 此外,光致酸产生剂可以通过使用工业上容易获得的环氧化合物的有效且简单的方法制备。

    Chemically amplified positive photoresist composition
    8.
    发明授权
    Chemically amplified positive photoresist composition 失效
    化学扩增的正性光致抗蚀剂组合物

    公开(公告)号:US06268106B1

    公开(公告)日:2001-07-31

    申请号:US09337434

    申请日:1999-06-21

    IPC分类号: G03F7004

    CPC分类号: G03F7/039 G03F7/0045

    摘要: A chemical amplification positive amplification which can be formed into resist patterns much improved in transparency, photosensitivity and resolution and is suitable to KrF and ArF excimer lasers, enabling a submicrolithography process to be as exquisite as 0.2 &mgr;m or less. This composition is based on a copolymer of the formula I, ranging, in polystyrene-reduced weight average molecular weight, from 3,000 to 50,000 with a molecular weight distribution (Mw/Mn) of 1.0 to 2.0, and a low molecular weight compound of the formula VI:

    摘要翻译: 化学放大阳性扩增可以形成抗蚀剂图案,其透明度,光敏度和分辨率大大提高,适用于KrF和ArF准分子激光器,使得亚微光刻工艺的精细度可达0.2μm或更小。 该组合物是基于式I的共聚物,以聚苯乙烯换算的重均分子量为3,000至50,000,分子量分布(Mw / Mn)为1.0至2.0,以及低分子量化合物 公式VI:

    PHOTOACID GENERATOR, METHOD FOR PRODUCING THE SAME, AND RESIST COMPOSITION COMPRISING THE SAME
    9.
    发明申请
    PHOTOACID GENERATOR, METHOD FOR PRODUCING THE SAME, AND RESIST COMPOSITION COMPRISING THE SAME 有权
    光致发电机及其制造方法以及包含该光电发生器的耐热组合物

    公开(公告)号:US20120203024A1

    公开(公告)日:2012-08-09

    申请号:US13367896

    申请日:2012-02-07

    摘要: A photoacid generator represented by the following formula (1), a method for producing the photoacid generator, and a resist composition containing the photoacid generator are provided. wherein in the formula (1), Y1, Y2, X, R1, R2, n1, n2 and A+ have the same meanings as defined in the detailed description of the invention. The photoacid generator can maintain an appropriate contact angle at the time of ArF liquid immersion lithography, can reduce defects occurring during liquid immersion lithography, and has excellent solubility in resist solvents and excellent compatibility with resins. Furthermore, the photoacid generator can be produced by an efficient and simple method using an epoxy compound that is industrially easily available.

    摘要翻译: 提供由下式(1)表示的光致酸发生剂,光酸产生剂的制造方法和含有光酸产生剂的抗蚀剂组合物。 其中,在式(1)中,Y1,Y2,X,R1,R2,n1,n2和A +具有与本发明的详细说明中所定义的相同的含义。 光致酸发生器可以在ArF液浸光刻时保持适当的接触角,可以减少液浸光刻过程中发生的缺陷,并且在抗蚀剂溶剂中具有优异的溶解性和与树脂的相容性优异。 此外,光致酸产生剂可以通过使用工业上容易获得的环氧化合物的有效且简单的方法制备。