公开(公告)号：US07087462B1

公开(公告)日：2006-08-08

申请号：US11160070

申请日：2005-06-07

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Chang-Young Sohn

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Chang-Young Sohn

IPC分类号： H01L21/44

CPC分类号： H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, adhering a die to the die pad, forming a plurality of conductive wires to electrically connect bond pads of the die with bond regions of the leads, forming an encapsulation covering the leadframe, forming a patterned photoresist layer on a lower surface of the leadframe to expose a plurality of interval regions and the outer dambars, performing an etching process to expose the metal layer located in the interval regions and the outer dambars, cutting off the metal layer located in the interval regions by a half cutting process, and performing a singulation process to singulate the units.

摘要翻译： 本发明包括提供一种引线框，其包括形成在引线框的上表面上的金属层和阵列布置中的多个单元，其中每个单元包括管芯焊盘，多个引线和多个外部堤坝， 将管芯附接到管芯焊盘，形成多个导电线以将管芯的接合焊盘与引线的接合区域电连接，形成覆盖引线框架的封装，在引线框架的下表面上形成图案化的光致抗蚀剂层以暴露 多个间隔区域和外部堤坝，进行蚀刻处理以暴露位于间隔区域中的金属层和外部堤坝，通过半切割过程切割位于间隔区域中的金属层，并执行单个切割处理 单位单位。