公开(公告)号：US07125747B2

公开(公告)日：2006-10-24

申请号：US10873152

申请日：2004-06-23

申请人： Yong-gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

发明人： Yong-gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for manufacturing a plurality of leadless semiconductor packages includes an electrically testing step to test encapsulated chips in a matrix of a leadless leadframe. Firstly, a leadless leadframe having at least a packaging matrix is provided. The packaging matrix defines a plurality of units and a plurality of cutting streets between the units. The leadless leadframe has a plurality of leads in the units and a plurality of connecting bars connecting the leads along the cutting streets. A plated metal layer is formed on the upper surfaces of the leads and the upper surfaces of the connecting bars. After die-attaching, wire-bonding connection, and encapsulation, the leadless leadframe is etched to remove the connecting bars, then two sawing steps are performed. During the first sawing step, the plated metal layer on the upper surface of the connecting bars is cut out to electrically isolate the leads. Therefore, a plurality of chips sealed by an encapsulant on the packaging matrix can be electrically tested by probing which is performed between the first sawing and the second sawing. Thereafter, the encapsulant is cut to form a plurality of individual package bodies of the leadless semiconductor packages during the second sawing.

摘要翻译： 一种用于制造多个无引线半导体封装的工艺包括电测试步骤，用于测试无引线框架的矩阵中的封装芯片。 首先，提供至少具有封装矩阵的无引线框架。 包装矩阵在单元之间定义多个单元和多个切割街道。 无引线框架在单元中具有多个引线，并且多个连接条沿着切割街道连接引线。 在引线的上表面和连接条的上表面上形成电镀金属层。 在裸片安装，引线键合连接和封装之后，对无引线框架进行蚀刻以去除连接条，然后执行两个锯切步骤。 在第一锯切步骤期间，切断连接条的上表面上的电镀金属层以使引线电隔离。 因此，可以通过在第一锯切和第二锯切之间执行的探测来电测试由包装基质上的密封剂密封的多个芯片。 此后，在第二次锯切期间，密封剂被切割以形成多个无引线半导体封装的单个封装体。

公开(公告)号：US20060199308A1

公开(公告)日：2006-09-07

申请号：US11068799

申请日：2005-03-02

申请人： Yong-Gill Lee ,  Jin-Young Hong ,  Hyung-Jun Park ,  Jin-Hee Won

发明人： Yong-Gill Lee ,  Jin-Young Hong ,  Hyung-Jun Park ,  Jin-Hee Won

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/568 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A process for manufacturing sawing type leadless semiconductor packages includes a post mold-curing step, which is performed after an encapsulant is formed and after connecting bars of a leadframe are removed. The connecting bars are formed between a plurality of package units of the leadframe to connect a plurality of leads in the package units. After die attachment and electrical connection, the encapsulant is formed over the package units and the connecting bars to encapsulate the chips. The connecting bars are removed prior to the post mold-curing step. Therefore the encapsulant can be cured without deformation or warpage, thereby facilitating the sequent processes.

摘要翻译： 一种用于制造锯切型无引线半导体封装件的方法，包括在形成密封剂之后并且在引线框架的连接条被移除之后进行的后模具固化步骤。 连接杆形成在引线框架的多个封装单元之间，以连接封装单元中的多个引线。 在管芯附接和电连接之后，密封剂形成在封装单元和连接条上以封装芯片。 在后模具固化步骤之前移除连接杆。 因此，密封剂可以在没有变形或翘曲的情况下固化，从而便于后续处理。

公开(公告)号：US20050287709A1

公开(公告)日：2005-12-29

申请号：US10873152

申请日：2004-06-23

申请人： Yong-Gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

发明人： Yong-Gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for manufacturing a plurality of leadless semiconductor packages includes an electrically testing step to test encapsulated chips in a matrix of a leadless leadframe. Firstly, a leadless leadframe having at least a packaging matrix is provided. The packaging matrix defines a plurality of units and a plurality of cutting streets between the units. The leadless leadframe has a plurality of leads in the units and a plurality of connecting bars connecting the leads along the cutting streets. A plated metal layer is formed on the upper surfaces of the leads and the upper surfaces of the connecting bars. After die-attaching, wire-bonding connection, and encapsulation, the leadless leadframe is etched to remove the connecting bars, then two sawing steps are performed. During the first sawing step, the plated metal layer on the upper surface of the connecting bars is cut out to electrically isolate the leads. Therefore, a plurality of chips sealed by an encapsulant on the packaging matrix can be electrically tested by probing which is performed between the first sawing and the second sawing. Thereafter, the encapsulant is cut to form a plurality of individual package bodies of the leadless semiconductor packages during the second sawing.

摘要翻译： 一种用于制造多个无引线半导体封装的工艺包括电测试步骤，用于测试无引线框架的矩阵中的封装芯片。 首先，提供至少具有封装矩阵的无引线框架。 包装矩阵在单元之间定义多个单元和多个切割街道。 无引线框架在单元中具有多个引线，并且多个连接条沿着切割街道连接引线。 在引线的上表面和连接条的上表面上形成电镀金属层。 在裸片安装，引线键合连接和封装之后，对无引线框架进行蚀刻以去除连接条，然后执行两个锯切步骤。 在第一锯切步骤期间，切断连接条的上表面上的电镀金属层以使引线电隔离。 因此，可以通过在第一锯切和第二锯切之间执行的探测来电测试由包装基质上的密封剂密封的多个芯片。 此后，在第二次锯切期间，密封剂被切割以形成多个无引线半导体封装的单个封装体。

公开(公告)号：US20050260795A1

公开(公告)日：2005-11-24

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US07211467B2

公开(公告)日：2007-05-01

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/00

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US20050258521A1

公开(公告)日：2005-11-24

申请号：US10851112

申请日：2004-05-24

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

摘要翻译： 具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。 引线布置在管芯焊盘的周围。 在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。

公开(公告)号：US07087462B1

公开(公告)日：2006-08-08

申请号：US11160070

申请日：2005-06-07

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Chang-Young Sohn

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Chang-Young Sohn

IPC分类号： H01L21/44

CPC分类号： H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention includes providing a leadframe including a metal layer formed on an upper surface of the leadframe and a plurality of units in an array arrangement, in which each unit includes a die pad, a plurality of leads, and a plurality of outer dambars, adhering a die to the die pad, forming a plurality of conductive wires to electrically connect bond pads of the die with bond regions of the leads, forming an encapsulation covering the leadframe, forming a patterned photoresist layer on a lower surface of the leadframe to expose a plurality of interval regions and the outer dambars, performing an etching process to expose the metal layer located in the interval regions and the outer dambars, cutting off the metal layer located in the interval regions by a half cutting process, and performing a singulation process to singulate the units.

摘要翻译： 本发明包括提供一种引线框，其包括形成在引线框的上表面上的金属层和阵列布置中的多个单元，其中每个单元包括管芯焊盘，多个引线和多个外部堤坝， 将管芯附接到管芯焊盘，形成多个导电线以将管芯的接合焊盘与引线的接合区域电连接，形成覆盖引线框架的封装，在引线框架的下表面上形成图案化的光致抗蚀剂层以暴露 多个间隔区域和外部堤坝，进行蚀刻处理以暴露位于间隔区域中的金属层和外部堤坝，通过半切割过程切割位于间隔区域中的金属层，并执行单个切割处理 单位单位。

公开(公告)号：US06984878B2

公开(公告)日：2006-01-10

申请号：US10851112

申请日：2004-05-24

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

摘要翻译： 具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。 引线布置在管芯焊盘的周围。 在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。