公开(公告)号：US06824858B2

公开(公告)日：2004-11-30

申请号：US10216802

申请日：2002-08-13

申请人： Satoru Iwaida ,  Yoshihiro Ohno ,  Masayuki Isono ,  Akio Sekimoto

发明人： Satoru Iwaida ,  Yoshihiro Ohno ,  Masayuki Isono ,  Akio Sekimoto

IPC分类号： B32B700

CPC分类号： G03F7/0388 ,  C08G59/4246 ,  C08G59/4292 ,  C09D163/00 ,  G03F7/032 ,  G03F7/038 ,  H05K3/287 ,  Y10T428/24917 ,  C08L2666/02

摘要： A photocurable and thermosetting composition which is useful in forming a matte film and can be developed with an aqueous alkaline solution is provided. The composition comprises (A) a photosensitive prepolymer obtained by causing a saturated or unsaturated polybasic acid anhydride to react with a hydroxyl group of an esterification product of a novolak type epoxy compound and an unsaturated monocarboxylic acid, (B) a carboxyl group-containing copolymer resin, (C) a photopolymerization initiator, (D) a diluent, (E) a polyfunctional epoxy compound having at least two epoxy groups in its molecule, and, when necessary, (F) an inorganic filler. The composition may further comprise (G) an epoxy resin curing agent. This composition can be advantageously used for the formation of a solder resist on a printed circuit board.

摘要翻译： 提供了可用于形成无光泽膜并且可以用碱性水溶液显影的光固化和热固性组合物。 组合物包含（A）通过使饱和或不饱和多元酸酐与酚醛清漆型环氧化合物和不饱和一元羧酸的酯化产物的羟基反应获得的光敏预聚物，（B）含羧基的共聚物 树脂，（C）光聚合引发剂，（D）稀释剂，（E）分子中具有至少两个环氧基的多官能环氧化合物，必要时，（F）无机填料。 组合物还可以包含（G）环氧树脂固化剂。 该组合物可有利地用于在印刷电路板上形成阻焊剂。