公开(公告)号：US06782619B2

公开(公告)日：2004-08-31

申请号：US09932266

申请日：2001-08-17

申请人： Scott S. Corbett, III ,  Timothy J. Johnson ,  Ben M. Clopton ,  Francis A. Spelman ,  Jeffery A. Strole ,  Joseph R. Ketterl

发明人： Scott S. Corbett, III ,  Timothy J. Johnson ,  Ben M. Clopton ,  Francis A. Spelman ,  Jeffery A. Strole ,  Joseph R. Ketterl

IPC分类号： H01R4300

CPC分类号： A61N1/0541 ,  Y10T29/49176

摘要： A laminated multi-electrode biocompatible implant, comprising a first layer of flexible, biocompatible dielectric material having a first, exposed surface. A second layer of flexible biocompatible dielectric material, is adhered to the first layer. Further, a third layer of flexible biocompatible dielectric material is adhered to the second layer. Additionally, a first conductive trace is interposed between the first layer and the second layer and a second conductive trace interposed between said second layer and said third layer. Finally, a first conductor, which breaches said first layer, conductively connects the first conductive trace to the exposed surface of the first layer, thereby forming a first electrode and a second conductor, which breaches the first layer and the second layer, conductively connects the second conductive trace to the exposed surface of the first layer, thereby forming a second electrode.

摘要翻译： 层压多电极生物相容性植入物，包括具有第一暴露表面的柔性生物相容介电材料的第一层。 柔性生物相容介电材料的第二层粘附到第一层。 此外，第三层柔性生物相容介电材料粘附到第二层。 此外，第一导电迹线插入在第一层和第二层之间，第二导电迹线插入在所述第二层和所述第三层之间。 最后，破坏所述第一层的第一导体将第一导电迹线导电地连接到第一层的暴露表面，从而形成破坏第一层和第二层的第一电极和第二导体，导电地连接 第二导电迹线到第一层的暴露表面，从而形成第二电极。

公开(公告)号：US06678564B2

公开(公告)日：2004-01-13

申请号：US10012230

申请日：2001-12-06

申请人： Joseph R. Ketterl ,  John P. Yarno ,  Scott S. Corbett, III ,  Thomas R. Clary

发明人： Joseph R. Ketterl ,  John P. Yarno ,  Scott S. Corbett, III ,  Thomas R. Clary

IPC分类号： A61N105

CPC分类号： A61N1/0541 ,  Y10T29/49124

摘要： A bio-implant having a length and a proximal and a distal end. The bio-implant has at least two lamina of dielectric material joined together, thereby defining a boundary and also defining a side surface that is intersected by this boundary. In addition, at least one set of conductors is interposed between the two lamina and extend lengthwise from the proximal end toward the distal end, each one of the set of conductors being terminated adjacent to the side surface to form a set of conductor terminations. Further, a set of electrode contact points are constructed on the side surface, with each electrode contact point contacting one of said conductor terminations.

摘要翻译： 具有长度和近端和远端的生物植入物。 生物植入物具有至少两层电介质材料连接在一起，从而限定边界并且还限定与该边界相交的侧表面。 此外，至少一组导体插入在两个薄片之间并且从近端朝向远端纵向地延伸，该组导体中的每一个邻近侧表面终止以形成一组导体终端。 此外，在侧表面上构造一组电极接触点，每个电极接触点接触所述导体终端之一。

公开(公告)号：US06967152B1

公开(公告)日：2005-11-22

申请号：US10686315

申请日：2003-10-15

申请人： Phillip L. Jordan ,  John P. Yarno ,  Jeffery A. Strole ,  Mikhail P. Bak ,  Joseph R. Ketterl

发明人： Phillip L. Jordan ,  John P. Yarno ,  Jeffery A. Strole ,  Mikhail P. Bak ,  Joseph R. Ketterl

IPC分类号： H01L21/44 ,  H05K3/10 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/107 ,  H05K3/28 ,  H05K3/46 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/0352 ,  H05K2201/09036

摘要： A method of producing a multi-level electronic device that begins with machining into a sheet of dielectric material from a surface to create a set of first indentations at a first level. Conductive material is then deposited into the first indentations to create a set of first conductive features. The first indentations are then substantially filled with dielectric material. The process is continued by machining again into the sheet of dielectric material from a surface and thereby creating a set of second indentations at a second level. Further conductive material is deposited into the second indentations to create a set of second conductive features.

摘要翻译： 一种制造多级电子装置的方法，该多级电子装置首先从表面机械加工成电介质材料片，以在一级形成一组第一压痕。 然后将导电材料沉积到第一压痕中以产生一组第一导电特征。 然后，第一压痕基本上被介电材料填充。 该过程通过从表面再次进入介电材料片继续进行，从而在第二级创建一组第二压痕。 另外的导电材料沉积到第二压痕中以产生一组第二导电特征。