公开(公告)号：US09308622B2

公开(公告)日：2016-04-12

申请号：US14057368

申请日：2013-10-18

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Andrew S. Menz ,  John F. Schmidt ,  Stephen J. Mackin

IPC: B24B49/10 ,  B24B37/013 ,  B24B37/04 ,  B24B49/12

CPC classification number: B24B49/105 ,  B24B37/013 ,  B24B37/048 ,  B24B49/12

Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.

Abstract translation: 本申请公开了一种研磨头的实施例，其包括在旋转研磨头的基部结构中的传感器装置。 为了操作，通过经由旋转轴联接到研磨头的驱动马达向研磨头施加旋转。 如所公开的，传感器装置通过旋转轴和连接到旋转轴的旋转电连接器电连接到一个或多个电子部件或电路。 在所公开的实施例中，传感器装置是涡流传感器，其构造成测量研磨头上的传感器元件与导电台板之间的间隙尺寸，以提供工件厚度的位置测量。

公开(公告)号：US20150111468A1

公开(公告)日：2015-04-23

申请号：US14057368

申请日：2013-10-18

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Andrew S. Menz ,  John F. Schmidt ,  Stephen J. Mackin

IPC: B24B49/10 ,  B24B37/04 ,  B24B37/013

CPC classification number: B24B49/105 ,  B24B37/013 ,  B24B37/048 ,  B24B49/12

Abstract: The application discloses embodiments of a lapping head including a sensor device in the base structure of the rotating lapping head. For operation, rotation is imparted to the lapping head through a drive motor coupled to the lapping head through a rotating shaft. As disclosed, the sensor device is electrically connected to one or more electronic components or circuitry through the rotating shaft and a rotating electrical connector coupled to the rotating shaft. In embodiments disclosed, the sensor device is an eddy current sensor configured to measure a gap dimension between a sensor element on the lapping head and a conductive platen to provide an in-situs measurement of workpiece thickness.

Abstract translation: 本申请公开了一种研磨头的实施例，其包括在旋转研磨头的基部结构中的传感器装置。 为了操作，通过经由旋转轴联接到研磨头的驱动马达向研磨头施加旋转。 如所公开的，传感器装置通过旋转轴和连接到旋转轴的旋转电连接器电连接到一个或多个电子部件或电路。 在所公开的实施例中，传感器装置是涡流传感器，其构造成测量研磨头上的传感器元件与导电台板之间的间隙尺寸，以提供工件厚度的位置测量。