公开(公告)号：US10646943B2

公开(公告)日：2020-05-12

申请号：US15361714

申请日：2016-11-28

Applicant: Seagate Technology LLC

Inventor： Aaron Michael Collins ,  Scott Daemon Matzke ,  Paul Davidson ,  Christopher R. Libby

IPC: B23K1/005 ,  H01R43/02

Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

公开(公告)号：US20180147646A1

公开(公告)日：2018-05-31

申请号：US15361714

申请日：2016-11-28

Applicant: Seagate Technology LLC

Inventor： Aaron Michael Collins ,  Scott Daemon Matzke ,  Paul Davidson ,  Christopher R. Libby

IPC: B23K1/005 ,  H01R43/02

CPC classification number: B23K1/0056 ,  B23K1/0016 ,  H01R43/0221

Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.