Intelligent defect identification system

    公开(公告)号:US11320385B2

    公开(公告)日:2022-05-03

    申请号:US16161387

    申请日:2018-10-16

    Abstract: Various defects in an electronic assembly can be intelligently identified with a system having at least a server connected to a first capture module and a second capture module. The first capture module may be positioned proximal a first manufacturing line while the second capture module is positioned proximal a second manufacturing line. Images can be collected of first and second electronic assemblies by respective first and second capture modules prior to the images being sent to a classification module of the server where at least one defect is automatically detected in each of the first and second electronic assemblies concurrently with the classification module.

    Automated and accurate high-throughput slider-level flatness inspection

    公开(公告)号:US10281268B1

    公开(公告)日:2019-05-07

    申请号:US15958646

    申请日:2018-04-20

    Abstract: A method includes receiving an image of a surface of a slider bar from an interferometer, where the slider bar includes at least two sliders, and where the image includes image data according to at least two image data channels for a slider bar surface and the at least two sliders. The method also includes generating a slider bar map of the surface of the slider bar based upon the image data of the image, where the slider bar map includes at least two data channels and ascertaining a plurality of individual slider surface maps based on a number of sliders included on the slider bar, where the ascertaining is also based upon the slider bar map having the at least two data channels. The method also includes segmenting the slider bar map according to the plurality of individual slider surface maps.

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