MULTILEVEL ENCLOSURE COOLING
    2.
    发明申请

    公开(公告)号:US20200253084A1

    公开(公告)日:2020-08-06

    申请号:US16263980

    申请日:2019-01-31

    Abstract: A system including an enclosure including a data storage enclosure. The data storage enclosure includes multiple storage levels and a shared cooling area. The system further includes data storage devices positioned within each of the multiple storage levels and a first and second set of air movers positioned within the data storage enclosure in the shared cooling area. The first and second sets of air movers are arranged to cool the data storage devices.

    HYBRID LIQUID COOLING AND AIR COOLING OF STORAGE ENCLOSURES

    公开(公告)号:US20200296860A1

    公开(公告)日:2020-09-17

    申请号:US16299305

    申请日:2019-03-12

    Abstract: An apparatus includes an enclosure with a first data storage section, a second data storage section, a first cooling section positioned therebetween, and a second cooling section. The apparatus also includes an air-to-liquid heat exchanger positioned in the first cooling section and configured to cool air directed from the first data storage section towards the second data storage section and the second cooling section.

    Multilevel enclosure cooling
    4.
    发明授权

    公开(公告)号:US10856436B2

    公开(公告)日:2020-12-01

    申请号:US16263980

    申请日:2019-01-31

    Abstract: A system including an enclosure including a data storage enclosure. The data storage enclosure includes multiple storage levels and a shared cooling area. The system further includes data storage devices positioned within each of the multiple storage levels and a first and second set of air movers positioned within the data storage enclosure in the shared cooling area. The first and second sets of air movers are arranged to cool the data storage devices.

    STORAGE DEVICE ASSEMBLY
    5.
    发明申请
    STORAGE DEVICE ASSEMBLY 有权
    存储设备组件

    公开(公告)号:US20170034945A1

    公开(公告)日:2017-02-02

    申请号:US14814268

    申请日:2015-07-30

    CPC classification number: H05K7/1492 H05K7/20736

    Abstract: The disclosed technology includes an open frame storage device assembly for computing equipment. The assembly is configured to vertically suspend carriers, which hold storage devices, from a rack and to interconnect the storage devices to a computer system. The disclosed assembly provides high storage capacity, low weight, efficient cooling, and centralized power.

    Abstract translation: 所公开的技术包括用于计算设备的开放式框架存储装置组件。 组件被配置为将保持存储设备的载体从机架垂直悬挂并将存储设备互连到计算机系统。 所公开的组件提供高存储容量,低重量,有效的冷却和集中的功率。

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