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公开(公告)号:US11780048B2
公开(公告)日:2023-10-10
申请号:US16869233
申请日:2020-05-07
Applicant: Seagate Technology LLC
Inventor: Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/005 , B24B37/12 , B24B53/017 , B24B37/04
CPC classification number: B24B37/12 , B24B37/005 , B24B37/04 , B24B53/017
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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公开(公告)号:US10737291B2
公开(公告)日:2020-08-11
申请号:US16059627
申请日:2018-08-09
Applicant: Seagate Technology LLC
Inventor: Daniel Richard Buettner , Andrew David Habermas , Daniel Sullivan , Joseph M. Stephan
IPC: G11B5/60 , B05D3/06 , B33Y10/00 , B33Y80/00 , B29C59/02 , G11B5/31 , G03F7/00 , B05D3/12 , B05D7/00 , B29C35/08
Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).
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公开(公告)号:US20190247976A1
公开(公告)日:2019-08-15
申请号:US15894081
申请日:2018-02-12
Applicant: Seagate Technology LLC
Inventor: Yuhong Xiong , Andrew David Habermas , Kok Yen Goh , PengKoon Hew
IPC: B24B37/30 , G11B5/31 , B24B37/005 , B24B37/04
Abstract: Embodiments of the present disclosure demonstrate a lapping carrier system for a bar to be lapped. The lapping carrier system may be configured with a single piece insert whose bridge is separated from a plurality of joints of the carrier insert by a varying distance. The varying distance can be greater at a medial portion of the bridge than at an end portion of the bridge to collectively form a parabolic shape. In some embodiments, a lapping insert can include a bridge with its length longer than the bar. In some embodiments in a lapping insert, the centerline between the end joint edge and the end finger edge extends beyond the edge of bar.
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公开(公告)号:US20170304988A1
公开(公告)日:2017-10-26
申请号:US15133415
申请日:2016-04-20
Applicant: Seagate Technology LLC
Inventor: Raymond Leroy Moudry , Mihaela Ruxandra Baurceanu , Joel William Hoehn , Andrew David Habermas
CPC classification number: B24B37/14 , B24B37/16 , B24D3/28 , B24D18/00 , B24D2203/00
Abstract: The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.
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公开(公告)号:US09343089B2
公开(公告)日:2016-05-17
申请号:US13791130
申请日:2013-03-08
Applicant: Seagate Technology LLC
Inventor: Andrew David Habermas , Dongsung Hong , Daniel Boyd Sullivan
CPC classification number: G11B5/3163 , B82Y10/00 , G11B5/3116 , G11B5/314 , Y10S977/887
Abstract: Nanoimprint lithography can be used in a variety of ways to improve resolution, pattern fidelity and symmetry of microelectronic structures for thin film head manufacturing. For example, write poles, readers, and near-field transducers can be manufactured with tighter tolerances that improve the performance of the microelectronic structures. Further, entire bars of thin film heads can be manufactured simultaneously using nanoimprint lithography, which reduces or eliminated alignment errors between neighboring thin film heads in a bar of thin film heads.
Abstract translation: 纳米压印光刻可以以各种方式用于提高薄膜头制造的微电子结构的分辨率,图案保真度和对称性。 例如,写极点,读取器和近场换能器可以用更严格的公差制造,从而改善微电子结构的性能。 此外,可以使用纳米压印光刻法同时制造薄膜头的整个条,这减少或消除了薄膜头中的相邻薄膜头之间的对准误差。
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6.
公开(公告)号:US20230405757A1
公开(公告)日:2023-12-21
申请号:US18240134
申请日:2023-08-30
Applicant: Seagate Technology LLC
Inventor: Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/12 , B24B37/005 , B24B53/017 , B24B37/04
CPC classification number: B24B37/12 , B24B37/005 , B24B53/017 , B24B37/04
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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7.
公开(公告)号:US20200262025A1
公开(公告)日:2020-08-20
申请号:US16869233
申请日:2020-05-07
Applicant: Seagate Technology LLC
Inventor: Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/12 , B24B37/005 , B24B53/017
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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公开(公告)号:US10682737B2
公开(公告)日:2020-06-16
申请号:US15198566
申请日:2016-06-30
Applicant: Seagate Technology LLC
Inventor: Chea Phann , Ricky Ray Anderson , Kevin Lambert Mayer , Mihaela Ruxandra Baurceanu , Andrew David Habermas , Raymond Leroy Moudry , Joel William Hoehn
IPC: B24B37/12 , B24B37/005 , B24B53/017
Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.
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9.
公开(公告)号:US10672423B2
公开(公告)日:2020-06-02
申请号:US15949192
申请日:2018-04-10
Applicant: Seagate Technology LLC
Inventor: Jeff R. O'Konski , Andrew David Habermas , Charles J. Mann , Greg A. Schmitz
Abstract: The present disclosure involves electronic test structures, and related methods, for use with one or more magnetoresistive elements at least at the wafer stage of slider manufacturing.
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10.
公开(公告)号:US20190311733A1
公开(公告)日:2019-10-10
申请号:US15949192
申请日:2018-04-10
Applicant: Seagate Technology LLC
Inventor: Jeff R. O'Konski , Andrew David Habermas , Charles J. Mann , Greg A. Schmitz
IPC: G11B5/455
Abstract: The present disclosure involves electronic test structures, and related methods, for use with one or more magnetoresistive elements at least at the wafer stage of slider manufacturing.
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