摘要:
A semiconductor device is fabricated with a protective liner and/or layer. Well regions and isolation regions are formed within a semiconductor body. A gate dielectric layer is formed over the semiconductor body. A gate electrode layer, such as polysilicon, is formed on the gate dielectric layer. A protective gate liner is formed on the gate electrode layer. A resist mask is formed that defines gate structures. The gate electrode layer is patterned to form the gate structures. Offset spacers are formed on lateral edges of the gate structures and extension regions are then formed in the well regions. Sidewall spacers are then formed on the lateral edges of the gate structures. An NMOS protective region layer is formed that covers the NMOS region of the device. A recess etch is performed within the PMOS region followed by formation of strain inducing recess structures.
摘要:
A semiconductor device is fabricated with a protective liner and/or layer. Well regions and isolation regions are formed within a semiconductor body. A gate dielectric layer is formed over the semiconductor body. A gate electrode layer, such as polysilicon, is formed on the gate dielectric layer. A protective gate liner is formed on the gate electrode layer. A resist mask is formed that defines gate structures. The gate electrode layer is patterned to form the gate structures. Offset spacers are formed on lateral edges of the gate structures and extension regions are then formed in the well regions. Sidewall spacers are then formed on the lateral edges of the gate structures. An NMOS protective region layer is formed that covers the NMOS region of the device. A recess etch is performed within the PMOS region followed by formation of strain inducing recess structures.
摘要:
The disclosure provides a trench isolation structure, a semiconductor device, and a method for manufacturing a semiconductor device. The semiconductor device, in one embodiment, includes a substrate having a first device region and a second device region, wherein the first device region includes a first gate structure and first source/drain regions and the second device region includes a second gate structure and second source/drain regions. The semiconductor device further includes a trench isolation structure configured to isolate the first device region from the second device region, the trench isolation structure comprising: 1) an isolation trench located within the substrate, wherein the isolation trench includes an opening portion and a bulbous portion, and further wherein a maximum width of the opening portion is less than a maximum width of the bulbous portion, and 2) dielectric material substantially filling the isolation trench.
摘要:
Semiconductor devices and fabrication methods are provided, in which gate defects associated with photoresist stress after plasma trim/etch are substantially reduced. The method comprises forming a gate dielectric layer above a semiconductor body substrate; coating the gate dielectric layer with a photoresist coating; exposing and developing the photoresist coating; performing a resist annealing; and trimming and etching the photoresist coating.
摘要:
A method of preparing a thin section sample includes affixing the sample to a receptacle using an affixing media that includes a material having a thickness-sensitive characteristic. The sample may then be shaped to have an asymmetric cross-section. The method may further include reducing a thickness of the material until the thickness-sensitive material exhibits a change in an optical characteristic. The added material, which may be quartz, may exhibit a predetermined optical characteristic at a specified thickness and/or exhibit a change in an optical characteristic in response to a change in thickness. In one application, the method may include retrieving the sample from a subterranean formation. For instance, the sample may be retrieved from a gas shale formation.
摘要:
A method of preparing a thin section sample includes affixing the sample to a receptacle using an affixing media that includes a material having a thickness-sensitive characteristic. The sample may then be shaped to have an asymmetric cross-section. The method may further include reducing a thickness of the material until the thickness-sensitive material exhibits a change in an optical characteristic. The added material, which may be quartz, may exhibit a predetermined optical characteristic at a specified thickness and/or exhibit a change in an optical characteristic in response to a change in thickness. In one application, the method may include retrieving the sample from a subterranean formation. For instance, the sample may be retrieved from a gas shale formation.
摘要:
In one embodiment, the invention provides an air movement device having a matrix polymer and nanoparticles. In another embodiment, the invention provides a method of manufacturing an air movement device having dry-mixing about 30% to about 80% by weight matrix polymer and about 2% to about 15% by weight layered clay to form a dry mixture, extruding the mixture to form a polymer nanocomposite, and molding the polymer nanocomposite into an air movement device. In yet another embodiment, the invention provides an air movement device having about 30% to about 80% by weight polypropylene, about 3% to about 10% by weight layered clay, and about 1% to about 10% by weight maleic anhydride grafted polystyrene, wherein the air movement device has a UL 94 5VA flame retardant rating.
摘要:
An apparatus includes an upper portion, a sole and a fin. The upper portion is configured to at least partially cover a foot. The sole is coupled to the upper portion and defines a cavity. The fin has a first portion and a second portion. The fin is movable between a first configuration and a second configuration. When in the first configuration, the fin is substantially within the cavity defined by the sole, and the first portion of the fin at least partially overlaps the second portion of the fin. When in the second configuration, the fin extends substantially outside the cavity defined by the sole.
摘要:
An apparatus includes an upper portion, a sole and a fin. The upper portion is configured to at least partially cover a foot. The sole is coupled to the upper portion and defines a cavity. The fin has a first portion and a second portion. The fin is movable between a first configuration and a second configuration. When in the first configuration, the fin is substantially within the cavity defined by the sole, and the first portion of the fin at least partially overlaps the second portion of the fin. When in the second configuration, the fin extends substantially outside the cavity defined by the sole.
摘要:
An apparatus includes an upper portion, a sole and a fin. The upper portion is configured to at least partially cover a foot. The sole is coupled to the upper portion and defines a cavity. The fin has a first portion and a second portion. The fin is movable between a first configuration and a second configuration. When in the first configuration, the fin is substantially within the cavity defined by the sole, and the first portion of the fin at least partially overlaps the second portion of the fin. When in the second configuration, the fin extends substantially outside the cavity defined by the sole.