公开(公告)号：US5780162A

公开(公告)日：1998-07-14

申请号：US489677

申请日：1995-06-13

申请人： Seiji Toyoda ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Akira Nakabayashi

发明人： Seiji Toyoda ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Akira Nakabayashi

IPC分类号： H01L21/48 ,  H01L23/15 ,  B32B15/00

CPC分类号： H01L21/481 ,  H01L23/15 ,  H01L2924/0002

摘要： An aluminum nitride (AlN) substrate comprising an AIN sinter, an Al.sub.2 O.sub.3 layer provided on the sinter, and a glass-mixed Al.sub.2 O.sub.3 layer which is provided on the Al.sub.2 O.sub.3 layer and contains Al.sub.2 O.sub.3 and glass mixed therewith, preferably with an oxide particle-dispersed glass layer and a main glass layer provided on the glass-mixed Al.sub.2 O.sub.3 layer. The AlN substrate has heat dissipation properties closer to those of AlN itself, does not cause generation of air bubbles at the junction interface between the AlN sinter and the glass-containing layer, and has excellent surface smoothness and corrosion resistance. The very fine conductive layer, etc. may be readily and firmly formed on the substrate in a stable manner.

摘要翻译： 包含AlN烧结体，设置在烧结体上的Al 2 O 3层的氮化铝（AlN）衬底以及设置在Al 2 O 3层上并含有Al 2 O 3和玻璃的玻璃混合Al 2 O 3层，优选与氧化物粒子分散玻璃 层和设置在玻璃混合Al 2 O 3层上的主玻璃层。 AlN衬底具有更接近于AlN本身的散热性能，不会在AlN烧结体和含玻璃层之间的接合界面处产生气泡，并且具有优异的表面平滑性和耐腐蚀性。 非常细的导电层等可以以稳定的方式容易且牢固地形成在基板上。

公开(公告)号：US6033787A

公开(公告)日：2000-03-07

申请号：US916258

申请日：1997-08-22

申请人： Toshiyuki Nagase ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Yoshio Kanda ,  Masafumi Hatsushika ,  Masato Otsuki

发明人： Toshiyuki Nagase ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Yoshio Kanda ,  Masafumi Hatsushika ,  Masato Otsuki

IPC分类号： B32B15/04 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  B22F3/00 ,  H01L23/10

CPC分类号： H05K3/0061 ,  B32B15/04 ,  H01L23/15 ,  H01L23/373 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K3/38 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/24926

摘要： A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

摘要翻译： 具有散热片的陶瓷电路板，其热循环寿命长。 第一和第二铝板分别通过Al-Si基钎焊焊料层压并结合到陶瓷衬底的两侧。 将由AlSiC基复合材料形成的散热片层叠并结合到第一铝板的表面上。 陶瓷基板由AlN，Si3N4或Al2O3形成。 散热器中的Al合金的Al纯度为80-99重量％，第一或第二铝板的Al纯度不低于99.98重量％。 通过散热器中的Al合金将散热片层压并结合到第一铝板上。

公开(公告)号：US06872115B2

公开(公告)日：2005-03-29

申请号：US10252361

申请日：2002-09-24

申请人： Hideaki Sakurai ,  Kunio Sugamura ,  Yoshio Kanda ,  Ryuji Uesugi ,  Yoshirou Kuromitsu ,  Young Cheul Kang ,  Eun Gi Heo ,  Young Soo Seo ,  Seung Jae Chung ,  Joon Min Kim ,  Hyun Sub Lee

发明人： Hideaki Sakurai ,  Kunio Sugamura ,  Yoshio Kanda ,  Ryuji Uesugi ,  Yoshirou Kuromitsu ,  Young Cheul Kang ,  Eun Gi Heo ,  Young Soo Seo ,  Seung Jae Chung ,  Joon Min Kim ,  Hyun Sub Lee

IPC分类号： H01J9/02 ,  B29C59/02 ,  H01J9/24 ,  H01J11/22 ,  H01J11/34 ,  H01J11/36 ,  H01J9/06

CPC分类号： H01J9/242 ,  B29C59/026 ,  B29C2059/027 ,  B29K2995/0087 ,  H01J2211/36

摘要： One object of the present invention is to provide a blade for forming ribs that is able to improve wear resistance; in order to achieve the object, the present invention provide a blade for forming ribs that forms ribs either on the surface of a substrate or via an undercoating layer on the surface of a substrate by moving a blade body in a fixed direction relative to a paste film in the state in which comb teeth formed on at least a portion of the periphery of said blade body are penetrated into said paste film formed on the surface of said substrate to plasticly deform said paste film; wherein, the surface of said comb teeth formed on said blade body that makes contact with said paste film is coated with a compound layer in which hard particles are dispersed in a metal.

摘要翻译： 本发明的一个目的是提供一种用于形成能够改善耐磨性的肋的刀片; 为了实现该目的，本发明提供了一种用于形成肋的刀片，所述刀片在衬底的表面上或通过基板表面上的底涂层形成肋，所述刀片相对于糊料沿固定方向移动刀片体 在形成在所述刀片主体的周边的至少一部分上的梳齿穿入所述基板的表面上形成的所述膏膜的状态下，使所述膏膜塑性变形的膜; 其特征在于，形成在所述刀片体上与所述糊状物膜接触的所述梳齿的表面涂覆有硬质粒子分散在金属中的化合物层。

公开(公告)号：US5466488A

公开(公告)日：1995-11-14

申请号：US193291

申请日：1994-02-08

申请人： Seiji Toyoda ,  Kunio Sugamura ,  Hideaki Yoshida

发明人： Seiji Toyoda ,  Kunio Sugamura ,  Hideaki Yoshida

IPC分类号： C04B41/52 ,  C04B41/89 ,  B05D3/02

CPC分类号： C04B41/009 ,  C04B41/52 ,  C04B41/89

摘要： A glazed AlN substrate includes: a sintered AlN body, a surface oxidized layer formed on the sintered AlN body, an Al.sub.2 O.sub.3 --SiO.sub.2 layer formed on top of the intermediate surface oxidized layer, and a glass layer formed on top of the Al.sub.2 O.sub.3 --SiO.sub.2 layer. In one embodiment, an additional SiO.sub.2 layer is interposed between the glass layer and the Al.sub.2 O.sub.3 --SiO.sub.2 layer. A method of producing the AlN substrate is also disclosed that permits firing of the glass layer at high temperatures.

摘要翻译： 釉面AlN基板包括：烧结AlN体，在烧结的AlN体上形成的表面氧化层，形成在中间表面氧化层的顶部的Al 2 O 3 -SiO 2层，以及形成在Al 2 O 3 -SiO 2层的顶部的玻璃层 。 在一个实施例中，在玻璃层和Al 2 O 3 -SiO 2层之间插入另外的SiO 2层。 还公开了一种制造AlN衬底的方法，其允许玻璃层在高温下烧制。