Semiconductor device and method for manufacturing the same
    2.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US09276091B2

    公开(公告)日:2016-03-01

    申请号:US14688199

    申请日:2015-04-16

    Abstract: A transistor including an oxide semiconductor film, which has stable electric characteristics is provided. A transistor including an oxide semiconductor film, which has excellent on-state characteristics is also provided. A semiconductor device in which an oxide semiconductor film having low resistance is formed and the resistance of a channel region of the oxide semiconductor film is increased. Note that an oxide semiconductor film is subjected to a process for reducing the resistance to have low resistance. The process for reducing the resistance of the oxide semiconductor film may be a laser process or heat treatment at a temperature higher than or equal to 450° C. and lower than or equal to 740° C., for example. A process for increasing the resistance of the channel region of the oxide semiconductor film having low resistance may be performed by plasma oxidation or implantation of oxygen ions, for example.

    Abstract translation: 提供具有稳定电特性的包括氧化物半导体膜的晶体管。 还提供了具有优异的导通状态特性的包括氧化物半导体膜的晶体管。 其中形成具有低电阻的氧化物半导体膜并且氧化物半导体膜的沟道区的电阻增加的半导体器件。 注意,氧化物半导体膜经受用于降低电阻以降低电阻的工艺。 用于降低氧化物半导体膜的电阻的方法可以是例如在高于或等于450℃且低于或等于740℃的温度下的激光处理或热处理。 例如,可以通过等离子体氧化或氧离子的注入来提高具有低电阻的氧化物半导体膜的沟道区域的电阻的方法。

    Method for manufacturing semiconductor device comprising oxide semiconductor layer
    3.
    发明授权
    Method for manufacturing semiconductor device comprising oxide semiconductor layer 有权
    一种用于制造包含氧化物半导体层的半导体器件的方法

    公开(公告)号:US09048265B2

    公开(公告)日:2015-06-02

    申请号:US13897502

    申请日:2013-05-20

    Abstract: A transistor including an oxide semiconductor film, which has stable electric characteristics is provided. A transistor including an oxide semiconductor film, which has excellent on-state characteristics is also provided. A semiconductor device in which an oxide semiconductor film having low resistance is formed and the resistance of a channel region of the oxide semiconductor film is increased. Note that an oxide semiconductor film is subjected to a process for reducing the resistance to have low resistance. The process for reducing the resistance of the oxide semiconductor film may be a laser process or heat treatment at a temperature higher than or equal to 450° C. and lower than or equal to 740° C., for example. A process for increasing the resistance of the channel region of the oxide semiconductor film having low resistance may be performed by plasma oxidation or implantation of oxygen ions, for example.

    Abstract translation: 提供具有稳定电特性的包括氧化物半导体膜的晶体管。 还提供了具有优异的导通状态特性的包括氧化物半导体膜的晶体管。 其中形成具有低电阻的氧化物半导体膜并且氧化物半导体膜的沟道区的电阻增加的半导体器件。 注意,氧化物半导体膜经受用于降低电阻以降低电阻的工艺。 用于降低氧化物半导体膜的电阻的方法可以是例如在高于或等于450℃且低于或等于740℃的温度下的激光处理或热处理。 例如,可以通过等离子体氧化或氧离子的注入来提高具有低电阻的氧化物半导体膜的沟道区域的电阻的方法。

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