公开(公告)号：US20030101616A1

公开(公告)日：2003-06-05

申请号：US10336193

申请日：2003-01-03

Applicant: Semitool, Inc.

Inventor： Dana Scranton ,  Ian Sharp

IPC: F26B003/00

CPC classification number: H01L21/67034 ,  B08B3/06 ,  B08B3/10 ,  B08B3/12 ,  H01L21/67028

Abstract: A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

公开(公告)号：US20020095816A1

公开(公告)日：2002-07-25

申请号：US10101045

申请日：2002-03-18

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Ian Sharp ,  Craig P. Meuchel ,  H. Frederick Woods

IPC: F26B021/06 ,  F26B005/04 ,  F26B003/00

CPC classification number: H01L21/67034 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67772 ,  H01L21/67775

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract translation: 用于半导体晶片的高压干燥的系统包括将晶片插入开放容器中，将晶片浸入液体中，对容器进行加压密封，用惰性气体加压容器，然后控制 使用从保持在气 - 液界面正下方的深度提取水的可移动排水来排出液体。 此后，可以在容器中降低压力，并且可以除去干燥和干净的晶片。 高压抑制液体的沸点，从而允许使用较高的温度来优化反应性。 超声波与加压流体一起使用，以提高清洁性能。 超临界物质设置在含有晶片的密封容器中以促进清洗和其它处理。

公开(公告)号：US20020026729A1

公开(公告)日：2002-03-07

申请号：US09924999

申请日：2001-08-07

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Ian Sharp ,  Craig P. Meuchel ,  H. Frederick Woods

IPC: F26B005/04

CPC classification number: H01L21/67034 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67772 ,  H01L21/67775

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

公开(公告)号：US20030088995A1

公开(公告)日：2003-05-15

申请号：US10334457

申请日：2002-12-30

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Ian Sharp ,  Craig P. Meuchel ,  H. Frederick Woods

IPC: F26B005/04

CPC classification number: H01L21/67034 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67772 ,  H01L21/67775

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract translation: 用于半导体晶片的高压干燥的系统包括将晶片插入开放容器中，将晶片浸入液体中，对容器进行加压密封，用惰性气体加压容器，然后控制 使用从保持在气 - 液界面正下方的深度提取水的可移动排水来排出液体。 此后，可以在容器中降低压力，并且可以除去干燥和干净的晶片。 高压抑制液体的沸点，从而允许使用较高的温度来优化反应性。 超声波与加压流体一起使用，以提高清洁性能。 超临界物质设置在含有晶片的密封容器中以促进清洁和其它处理。