公开(公告)号：US20020000378A1

公开(公告)日：2002-01-03

申请号：US09884003

申请日：2001-06-18

Applicant: Semitool, Inc.

Inventor： Robert W. Batz, JR. ,  Scot Conrady ,  Thomas L. Ritzdorf

IPC: C25D003/60 ,  C25D021/12

CPC classification number: C25D3/30 ,  C25D3/34 ,  C25D7/123 ,  C25D17/001

Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution. An anode, preferably a consumable anode, is spaced from the workpiece support within the reaction chamber and is in contact with the electroplating solution. In accordance with one embodiment the electroplating solution comprises a concentration of a lead compound, a concentration of a tin compound, water and methane sulfonic acid.

Abstract translation: 本发明涉及一种改进的电镀方法，化学和装置，用于根据从诸如半导体晶片的工件制造微电子器件，以高沉积速率选择性地沉积锡/铅焊料凸块和其它结构。 根据本发明的一个方面的用于在微电子工件上电镀焊料的装置包括反应室，该反应室含有具有锡和铅的游离离子的电镀溶液，用于电镀到工件上。 化学输送系统用于以高流速将电镀溶液输送到反应室。 使用工件支撑件，其包括用于向要被电镀的工件的一侧的表面提供电镀功率的接触组件。 触点在与暴露于电镀溶液中分离的大量离散接触点处接触工件。 阳极，优选是可消耗阳极，与反应室内的工件支撑件间隔开并与电镀溶液接触。 根据一个实施例，电镀溶液包含铅化合物的浓度，锡化合物的浓度，水和甲烷磺酸。