公开(公告)号：US11270983B2

公开(公告)日：2022-03-08

申请号：US16601150

申请日：2019-10-14

Applicant: Semtech Corporation

Inventor： David Francis Courtney ,  Angel Mario Cano Garza

IPC: H01L21/02 ,  H01L25/07 ,  H01L23/14

Abstract: A circuit, comprising a diode, a conductive upper support disposed on top of the diode and electrically coupled to the diode, a conductive lower support disposed underneath the diode and electrically coupled to the diode, a mechanical support disposed adjacent to the diode, the conductive upper support and the conductive lower support, an insulator disposed underneath the mechanical support, an upper terminal coupled to the mechanical support and electrically coupled to the conductive upper support and a lower terminal coupled to the insulator and electrically coupled to the conductive lower support.