公开(公告)号：US20080308536A1

公开(公告)日：2008-12-18

申请号：US11818851

申请日：2007-06-15

申请人： Senthil Theppakuttai ,  Peter J. Klaerner ,  Jason Bradach ,  Mark Cunningham ,  Bahadir Tunaboylu

发明人： Senthil Theppakuttai ,  Peter J. Klaerner ,  Jason Bradach ,  Mark Cunningham ,  Bahadir Tunaboylu

IPC分类号： B23K26/00

CPC分类号： G01R3/00 ,  G01R1/07342 ,  H05K3/328

摘要： An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.

摘要翻译： 使用激光焊接组装和修复探针组件的方法包括将束元件对准探针衬底上的柱元件。 梁元件定位成与探针基板上的柱元件接触。 然后通过将束元件通过激光焊接到探针基板上的柱元件将束元件附接到探针基板上的柱元件。 该方法可以包括使用真空毛细管拾取工具来对准和定位束元件。 真空毛细管拾取工具还可以与用于将激光束引导到用于焊接的正确位置的激光束传送系统一起操作，并且还帮助去除归因于激光焊接过程的气体和碎屑。 该方法允许探针元件直接连接到探针衬底而不需要中间层。

公开(公告)号：US08299394B2

公开(公告)日：2012-10-30

申请号：US11818851

申请日：2007-06-15

申请人： Senthil Theppakuttai ,  Peter J. Klaerner ,  Jason Bradach ,  Mark Cunningham ,  Bahadir Tunaboylu

发明人： Senthil Theppakuttai ,  Peter J. Klaerner ,  Jason Bradach ,  Mark Cunningham ,  Bahadir Tunaboylu

IPC分类号： B23K26/00

CPC分类号： G01R3/00 ,  G01R1/07342 ,  H05K3/328

摘要： An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.

摘要翻译： 使用激光焊接组装和修复探针组件的方法包括将束元件对准探针衬底上的柱元件。 梁元件定位成与探针基板上的柱元件接触。 然后通过将束元件通过激光焊接到探针基板上的柱元件将束元件附接到探针基板上的柱元件。 该方法可以包括使用真空毛细管拾取工具来对准和定位束元件。 真空毛细管拾取工具还可以与用于将激光束引导到用于焊接的正确位置的激光束传送系统一起操作，并且还帮助去除归因于激光焊接过程的气体和碎屑。 该方法允许探针元件直接连接到探针衬底而不需要中间层。

公开(公告)号：US20090174423A1

公开(公告)日：2009-07-09

申请号：US12398905

申请日：2009-03-05

申请人： Peter J. Klaerner ,  Son N. Dang ,  Pastor Yanga ,  Gerald W. Back ,  Victor Golubic ,  Bahadir Tunaboylu

发明人： Peter J. Klaerner ,  Son N. Dang ,  Pastor Yanga ,  Gerald W. Back ,  Victor Golubic ,  Bahadir Tunaboylu

IPC分类号： G01R31/02

CPC分类号： G01R1/0466 ,  B82Y30/00 ,  G01R1/07342 ,  G01R1/0735 ,  G01R1/07357 ,  Y10T29/49147

摘要： A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.

摘要翻译： 探针卡组件包括基底和结合到基底表面的多个探针。 探针卡组件还包括设置在基板的表面上的加强层。 增强层与每个探针的下部接触，其中每个探针的剩余部分没有加强层。 增强层可以是复合增强层，其包括多层材料以实现特定的结果。 根据本发明的一个实施例，加强层包括设置在基底上的粉末层和形成在粉末层上的粘合剂层。 复合增强层可以是顺应性的，以允许探针按预期的方式弯曲和移动，而不限制挠曲能力。 复合增强层可以是可移除的，以允许进入探针以进行修复。