公开(公告)号：US07704846B2

公开(公告)日：2010-04-27

申请号：US11546358

申请日：2006-10-12

申请人： Seung-Hyun Cho ,  Il-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  Il-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

IPC分类号： H01L21/20

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L23/642 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K3/323 ,  H05K2201/0347 ,  H05K2201/0355 ,  H01L2224/05599

摘要： A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.

摘要翻译： 公开了一种用于制造嵌入无源器件的衬底的方法，包括以下步骤：（a）模制无源器件，和（b）将模制的无源器件安装在形成在衬底上的空腔中。 嵌入无源器件的衬底及其根据本发明的制造方法可以防止由材料的不均衡性质引起的衬底翘曲。