公开(公告)号：US07704846B2

公开(公告)日：2010-04-27

申请号：US11546358

申请日：2006-10-12

申请人： Seung-Hyun Cho ,  Il-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  Il-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

IPC分类号： H01L21/20

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L23/642 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K3/323 ,  H05K2201/0347 ,  H05K2201/0355 ,  H01L2224/05599

摘要： A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.

摘要翻译： 公开了一种用于制造嵌入无源器件的衬底的方法，包括以下步骤：（a）模制无源器件，和（b）将模制的无源器件安装在形成在衬底上的空腔中。 嵌入无源器件的衬底及其根据本发明的制造方法可以防止由材料的不均衡性质引起的衬底翘曲。

公开(公告)号：US20070087512A1

公开(公告)日：2007-04-19

申请号：US11546358

申请日：2006-10-12

申请人： Seung-Hyun Cho ,  ll-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

发明人： Seung-Hyun Cho ,  ll-Soung Yoon ,  Won-Cheol Bae ,  Se-Jong Oh

IPC分类号： H01L21/20

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L23/642 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K3/323 ,  H05K2201/0347 ,  H05K2201/0355 ,  H01L2224/05599

摘要： A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.

摘要翻译： 公开了一种用于制造嵌入无源器件的衬底的方法，包括以下步骤：（a）模制无源器件，和（b）将模制的无源器件安装在形成在衬底上的空腔中。 嵌入无源器件的衬底及其根据本发明的制造方法可以防止由材料的不均衡性质引起的衬底翘曲。

公开(公告)号：US20080041619A1

公开(公告)日：2008-02-21

申请号：US11889498

申请日：2007-08-14

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim

IPC分类号： H05K1/16 ,  H05K3/36

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10T29/49126

摘要： A component-embedded multilayer printed wiring board and manufacturing method thereof. A component-embedded multilayer printed wiring board that includes: a first wiring board, in which a component is embedded; an intermediate layer which is stacked on the first wiring board and through which at least one conductive bump penetrates in correspondence to a wiring pattern formed on the first wiring board; and a second wiring board which is stacked on the intermediate layer and on a surface of which a wiring pattern is formed in correspondence with the conductive bump, can contribute to forming smaller and more functional electronic products, and by individually producing wiring boards having embedded components and then stacking these with intermediate layers interposed in-between, the defect status of each wiring board can be examined in advance, while this approach can be used in conjunction with existing surface mounting approaches to increase the effective mounting area.

摘要翻译： 一种组件嵌入式多层印刷线路板及其制造方法。 一种部件嵌入式多层印刷电路板，其特征在于，包括：嵌入有部件的第一布线基板; 层叠在所述第一布线基板上的中间层，至少一个导电凸块与形成在所述第一布线基板上的布线图形对应地贯穿所述中间层; 并且与导电凸块对应地堆叠在中间层上并且其表面上形成有布线图案的第二布线板可以有助于形成更小和更多功能的电子产品，并且通过单独制造具有嵌入部件的布线板 然后将中间层叠置在其间，可以预先检查各布线基板的缺陷状态，同时可以与现有的表面安装方式结合使用，以增加有效的安装面积。

公开(公告)号：US20050060732A1

公开(公告)日：2005-03-17

申请号：US10704811

申请日：2003-11-12

申请人： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

发明人： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

IPC分类号： G11B7/09 ,  G11B7/08 ,  G11B7/085 ,  G11B7/22 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00

CPC分类号： H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

摘要： An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

摘要翻译： 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。

公开(公告)号：US20090124043A1

公开(公告)日：2009-05-14

申请号：US12149837

申请日：2008-05-08

申请人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

IPC分类号： H01L21/52

CPC分类号： H05K1/187 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2203/1469

摘要： A method of manufacturing a package board is disclosed. The method is for manufacturing a package board that has a pad electrically connected with a component, and includes: forming an indentation, which is in correspondence with the pad, in one side of a first insulating layer; filling a metal paste in the indentation; mounting the component on the first insulating layer in correspondence with a location of the indentation; and hardening the metal paste. Using this method, damage to the component can be prevented during the forming of vias, as the component is mounted after filling paste in an indentation formed in an insulating layer.

摘要翻译： 公开了一种制造封装板的方法。 该方法用于制造具有与部件电连接的焊盘的封装板，并且包括：在第一绝缘层的一侧形成与焊盘相对应的凹陷; 在压痕中填充金属膏; 将零件安装在与压痕位置对应的第一绝缘层上; 并硬化金属膏。 使用这种方法，在形成通孔期间可以防止部件的损坏，因为在将糊料填充在形成在绝缘层中的凹陷中之后安装部件。

公开(公告)号：US07348772B2

公开(公告)日：2008-03-25

申请号：US10975736

申请日：2004-10-28

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。

公开(公告)号：US07337453B2

公开(公告)日：2008-02-26

申请号：US10704811

申请日：2003-11-12

申请人： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

发明人： Myung-Sam Kang ,  Kyung-Sik Shin ,  Won-Cheol Bae ,  Chang-Sup Ryu

IPC分类号： G11B7/085 ,  G11B7/09

CPC分类号： H05K1/165 ,  G11B7/08582 ,  G11B7/0933 ,  G11B7/0935 ,  H05K1/115 ,  H05K2201/097 ,  H05K2201/10121

摘要： An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a printed circuit board manufacturing technology and integrally formed with the winding coil in a monolithic body. The bobbin used with the optical pickup actuator includes the printed circuit board, a plurality of tracking circuit patterns formed on both surfaces of the PCB, a plurality of focusing circuit patterns formed on the both surfaces of the PCB, a plurality of via holes formed on the PCB to electrically connect the tracking circuit patterns and the focusing circuit patterns, an objective lens mounting unit formed on the PCB, and a connecting pad through which a power is supplied to the tracking and focusing circuit patterns.

摘要翻译： 一种光学拾取器致动器及其方法包括：具有用于扫描光盘轨道上的激光束的透镜的绕线管，在聚焦和跟踪方向上将线轴移动到轨道上的绕组线圈，以及用作线轴的集成电路板 使用印刷电路板制造技术，并且与卷绕线圈整体形成在一体的单体中。 与光拾取器致动器一起使用的筒管包括印刷电路板，形成在PCB的两个表面上的多个跟踪电路图案，形成在PCB的两个表面上的多个聚焦电路图案，多个通孔形成在 所述PCB用于电连接所述跟踪电路图案和所述聚焦电路图案，形成在所述PCB上的物镜安装单元和连接焊盘，通过所述连接焊盘向所述跟踪和聚焦电路图案供电。

公开(公告)号：US08011086B2

公开(公告)日：2011-09-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/36 ,  H05K3/02 ,  H01R9/00

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20080052906A1

公开(公告)日：2008-03-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/02

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US07886433B2

公开(公告)日：2011-02-15

申请号：US12007795

申请日：2008-01-15

申请人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/185 ,  B32B3/06 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/09509 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/22 ,  H01L2224/82

摘要： A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

摘要翻译： 公开了一种组件嵌入式PCB及其制造方法。 使用包括在芯基板中穿孔的方法; 将部件插入腔中; 在芯基板上堆叠薄膜层; 通过选择性地将所述膜层留在所述元件的至少一个电极的位置上而形成至少一个柱; 覆盖所述芯基板上的绝缘层，使得所述柱穿透所述绝缘层以在所述绝缘层的表面上暴露; 并且通过去除柱形成至少一个通孔，可以提供更高的精度和更细的间距。 此外，由于在加工通孔时不使用激光，因此防止了由于激光而可能发生的部件的损坏。 此外，可能会降低公差缺陷，以及加工后残留物造成的缺陷。