公开(公告)号：US08330898B2

公开(公告)日：2012-12-11

申请号：US12559857

申请日：2009-09-15

申请人： Seung-han Paek ,  Sung-hwan Kim

发明人： Seung-han Paek ,  Sung-hwan Kim

IPC分类号： G02F1/1335 ,  G02F1/1333

CPC分类号： G02F1/133603 ,  G02F1/133305

摘要： A flexible liquid crystal display device includes a first flexible substrate having a display region and a non-display region at a periphery of the display region; an organic electroluminescent diode including a first electrode on the first flexible substrate, an organic emitting layer on the first electrode and a second electrode on the organic emitting layer, wherein each of the first electrode, the organic emitting layer and the second electrode covering an entire surface of the display region; a buffer layer on the organic electroluminescent diode; a gate line on the buffer layer; a data line over the buffer layer and crossing the gate line to define a pixel region at the display region; a thin film transistor connected to the gate and data lines; a pixel electrode connected to the thin film transistor; a second flexible substrate facing the first flexible substrate; a common electrode on the second flexible substrate; and a liquid crystal layer between the pixel and common electrodes.

摘要翻译： 柔性液晶显示装置包括在显示区域的周围具有显示区域和非显示区域的第一柔性基板; 包括第一柔性基板上的第一电极，第一电极上的有机发光层和有机发光层上的第二电极的有机电致发光二极管，其中第一电极，有机发光层和第二电极中的每一个覆盖整个 显示区域的表面; 有机电致发光二极管上的缓冲层; 缓冲层上的栅极线; 在缓冲层上方的数据线，并与栅极线交叉以在显示区域上限定像素区域; 连接到栅极和数据线的薄膜晶体管; 连接到薄膜晶体管的像素电极; 面向所述第一柔性基板的第二柔性基板; 第二柔性基板上的公共电极; 以及像素和公共电极之间的液晶层。

公开(公告)号：US20070284947A1

公开(公告)日：2007-12-13

申请号：US11696801

申请日：2007-04-05

申请人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

发明人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

IPC分类号： H02M1/00

CPC分类号： H02M7/003 ,  H01L25/165 ,  H01L2924/0002 ,  H05K7/1432 ,  Y10T29/49002 ,  Y10T307/406 ,  H01L2924/00

摘要： Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.

摘要翻译： 提供了容易满足用户要求并具有经济实用性和高集成度的电力系统模块及其制造方法。 电力系统模块包括塑料外壳，成型型电源模块封装，控制电路板和至少一个外部端子。 塑料外壳限定了底部和侧壁。 成型型电源模块封装被固定在塑料外壳的底部，并且至少包括其中的电源装置。 控制电路板固定在塑料外壳的侧壁上，至少包括安装在其上的与电源模块封装电连接的控制装置。 外部端子突出到塑料外壳的外部并且电连接到控制电路板。

公开(公告)号：US07268414B2

公开(公告)日：2007-09-11

申请号：US10379979

申请日：2003-03-04

申请人： Seung-yong Choi ,  Seung-han Paek

发明人： Seung-yong Choi ,  Seung-han Paek

IPC分类号： H01L23/495

CPC分类号： H05K3/303 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A semiconductor package mounted on a printed circuit board using improved-reliability solder joints is described. The semiconductor package includes a lead frame pad and lead frame lead attached to the solder joints, a semiconductor chip mounted on top of the lead frame pad, wires electrically connecting the semiconductor chip and the lead frame lead, an epoxy molding compound that exposes the lower portion surface of the lead frame pad and part of the lead frame lead, and protrusions fixed to the lower portion surface of the epoxy molding compound and positioned between the solder joints, with the protrusions supporting the semiconductor package when the epoxy molding compound is mounted on the printed circuit board.

摘要翻译： 描述了使用改进的可靠性焊接接头安装在印刷电路板上的半导体封装。 半导体封装包括引线框架焊盘和附接到焊接点的引线框架引线，安装在引线框架焊盘顶部的半导体芯片，电连接半导体芯片和引线框架引线的导线，暴露下部的环氧树脂模塑料 引线框架衬垫的部分表面和引线框架引线的一部分，以及固定到环氧树脂模制化合物的下部表面并位于焊料接头之间的凸起，当环氧模塑料安装在其上时，凸起支撑半导体封装 印刷电路板。

公开(公告)号：US07986531B2

公开(公告)日：2011-07-26

申请号：US12722153

申请日：2010-03-11

申请人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

发明人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

IPC分类号： H05K5/00

CPC分类号： H02M7/003 ,  H01L25/165 ,  H01L2924/0002 ,  H05K7/1432 ,  Y10T29/49002 ,  Y10T307/406 ,  H01L2924/00

摘要： Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.

摘要翻译： 提供了容易满足用户要求并具有经济实用性和高集成度的电力系统模块及其制造方法。 电力系统模块包括塑料外壳，成型型电源模块封装，控制电路板和至少一个外部端子。 塑料外壳限定了底部和侧壁。 成型型电源模块封装被固定在塑料外壳的底部，并且至少包括其中的电源装置。 控制电路板固定在塑料外壳的侧壁上，至少包括安装在其上的与电源模块封装电连接的控制装置。 外部端子突出到塑料外壳的外部并且电连接到控制电路板。

公开(公告)号：US20100165576A1

公开(公告)日：2010-07-01

申请号：US12722153

申请日：2010-03-11

申请人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

发明人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H02M7/003 ,  H01L25/165 ,  H01L2924/0002 ,  H05K7/1432 ,  Y10T29/49002 ,  Y10T307/406 ,  H01L2924/00

摘要： Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.

摘要翻译： 提供了容易满足用户要求并具有经济实用性和高集成度的电力系统模块及其制造方法。 电力系统模块包括塑料外壳，成型型电源模块封装，控制电路板和至少一个外部端子。 塑料外壳限定了底部和侧壁。 成型型电源模块封装被固定在塑料外壳的底部，并且至少包括其中的电源装置。 控制电路板固定在塑料外壳的侧壁上，至少包括安装在其上的与电源模块封装电连接的控制装置。 外部端子突出到塑料外壳的外部并且电连接到控制电路板。

公开(公告)号：US07706146B2

公开(公告)日：2010-04-27

申请号：US11696801

申请日：2007-04-05

申请人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

发明人： Keun-hyuk Lee ,  Seung-won Lim ,  Seung-han Paek ,  Sung-min Park

IPC分类号： H05K5/00

CPC分类号： H02M7/003 ,  H01L25/165 ,  H01L2924/0002 ,  H05K7/1432 ,  Y10T29/49002 ,  Y10T307/406 ,  H01L2924/00

摘要： Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.

摘要翻译： 提供了容易满足用户要求并具有经济实用性和高集成度的电力系统模块及其制造方法。 电力系统模块包括塑料外壳，成型型电源模块封装，控制电路板和至少一个外部端子。 塑料外壳限定了底部和侧壁。 成型型电源模块封装被固定在塑料外壳的底部，并且至少包括其中的电源装置。 控制电路板固定在塑料外壳的侧壁上，至少包括安装在其上的与电源模块封装电连接的控制装置。 外部端子突出到塑料外壳的外部并且电连接到控制电路板。