Manufacture and method of sealing an organic light emitting display
    1.
    发明授权
    Manufacture and method of sealing an organic light emitting display 有权
    密封有机发光显示器的制造方法

    公开(公告)号:US07846001B2

    公开(公告)日:2010-12-07

    申请号:US11843648

    申请日:2007-08-23

    IPC分类号: H01J9/00 H01J9/40

    摘要: A method for manufacturing an organic light emitting display. Pixel portions are formed on a mother substrate. A test wiring for testing pixel portions is formed at a peripheral portion of the mother substrate. A sealing material is formed at one surface of a sealing substrate to enclose the pixel portions, the sealing substrate being sealed to be spaced apart from the mother substrate. A spacer is formed at a side region of the one surface of the sealing substrate on which the sealing material is formed. The mother substrate and the sealing substrate are adhered to each other by the sealing material to seal the pixel portions within an enclosure formed by the mother substrate, sealing surface, and sealing material. A part of the sealing substrate is scribed and removed to expose the test wiring, the part of sealing substrate being arranged over a portion of the test wiring.

    摘要翻译: 一种制造有机发光显示器的方法。 在母基板上形成像素部分。 用于测试像素部分的测试布线形成在母基片的周边部分。 密封材料形成在密封基板的一个表面以包围像素部分,密封基板被密封以与母基板间隔开。 在形成有密封材料的密封基板的一个表面的侧面形成间隔物。 母基板和密封基板通过密封材料彼此粘合,以密封由母基板,密封表面和密封材料形成的外壳内的像素部分。 密封基板的一部分被划线并移除以暴露测试布线,密封基板的一部分布置在测试布线的一部分上。

    METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY
    2.
    发明申请
    METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY 有权
    制造有机发光显示器的方法

    公开(公告)号:US20080160864A1

    公开(公告)日:2008-07-03

    申请号:US11843648

    申请日:2007-08-23

    IPC分类号: H01J9/26

    摘要: A method for manufacturing an organic light emitting display. Pixel portions are formed on a mother substrate. A test wiring for testing pixel portions is formed at a peripheral portion of the mother substrate. A sealing material is formed at one surface of a sealing substrate to enclose the pixel portions, the sealing substrate being sealed to be spaced apart from the mother substrate. A spacer is formed at a side region of the one surface of the sealing substrate on which the sealing material is formed. The mother substrate and the sealing substrate are adhered to each other by the sealing material to seal the pixel portions within an enclosure formed by the mother substrate, sealing surface, and sealing material. A part of the sealing substrate is scribed and removed to expose the test wiring, the part of sealing substrate being arranged over a portion of the test wiring.

    摘要翻译: 一种制造有机发光显示器的方法。 在母基板上形成像素部分。 用于测试像素部分的测试布线形成在母基片的周边部分。 密封材料形成在密封基板的一个表面以包围像素部分,密封基板被密封以与母基板间隔开。 在形成有密封材料的密封基板的一个表面的侧面形成间隔物。 母基板和密封基板通过密封材料彼此粘合,以密封由母基板,密封表面和密封材料形成的外壳内的像素部分。 密封基板的一部分被划线并移除以暴露测试布线,密封基板的一部分布置在测试布线的一部分上。

    LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME 有权
    发光显示装置及其制造方法

    公开(公告)号:US20090039760A1

    公开(公告)日:2009-02-12

    申请号:US12135920

    申请日:2008-06-09

    IPC分类号: H01J1/62 F21V15/00 H01J9/26

    CPC分类号: H01L51/5246 H01L2251/566

    摘要: Disclosed is a light emitting display device including a seal and a method of fabricating the same. The light emitting display device includes a first substrate composed of a pixel region and a non-pixel region disposed around the pixel region; a pad portion formed in the non-pixel region to supply a signal to the pixel region; a second substrate disposed to face the first substrate; and a seal provided between the first substrate and the second substrate and disposed to surround the pixel region. Here, the seal is disposed on a first side between the pixel region and the pad portion, on a second side facing the first side, and on an outer ring of third sides contacting both ends of the first side and the second side, and the seal disposed in the outer ring of the third sides is filled up to contour lines of the first substrate and the second substrate.

    摘要翻译: 公开了一种包括密封件的发光显示装置及其制造方法。 发光显示装置包括由像素区域和设置在像素区域周围的非像素区域构成的第一基板; 形成在所述非像素区域中以向所述像素区域提供信号的焊盘部分; 设置成面对第一基板的第二基板; 以及设置在所述第一基板和所述第二基板之间并且被设置为围绕所述像素区域的密封件。 这里,密封件设置在像素区域和焊盘部分之间的第一侧上,在面向第一侧的第二侧上,并且在与第一侧和第二侧的两端接触的第三侧的外环上, 设置在第三侧的外圈中的密封件被填充到第一基板和第二基板的轮廓线上。

    Light emitting display device and method of fabricating the same
    4.
    发明授权
    Light emitting display device and method of fabricating the same 有权
    发光显示装置及其制造方法

    公开(公告)号:US08016632B2

    公开(公告)日:2011-09-13

    申请号:US12135920

    申请日:2008-06-09

    IPC分类号: H01L51/56 H01J9/32 H01J9/26

    CPC分类号: H01L51/5246 H01L2251/566

    摘要: Disclosed is a light emitting display device including a seal and a method of fabricating the same. The light emitting display device includes a first substrate composed of a pixel region and a non-pixel region disposed around the pixel region; a pad portion formed in the non-pixel region to supply a signal to the pixel region; a second substrate disposed to face the first substrate; and a seal provided between the first substrate and the second substrate and disposed to surround the pixel region. Here, the seal is disposed on a first side between the pixel region and the pad portion, on a second side facing the first side, and on an outer ring of third sides contacting both ends of the first side and the second side, and the seal disposed in the outer ring of the third sides is filled up to contour lines of the first substrate and the second substrate.

    摘要翻译: 公开了一种包括密封件的发光显示装置及其制造方法。 发光显示装置包括由像素区域和设置在像素区域周围的非像素区域构成的第一基板; 形成在所述非像素区域中以向所述像素区域提供信号的焊盘部分; 设置成面对第一基板的第二基板; 以及设置在所述第一基板和所述第二基板之间并且被设置为围绕所述像素区域的密封件。 这里,密封件设置在像素区域和焊盘部分之间的第一侧上,在面向第一侧的第二侧上,并且在与第一侧和第二侧的两端接触的第三侧的外环上, 设置在第三侧的外圈中的密封件被填充到第一基板和第二基板的轮廓线上。

    Light emitting display and method of manufacturing the same
    5.
    发明授权
    Light emitting display and method of manufacturing the same 有权
    发光显示器及其制造方法

    公开(公告)号:US08269417B2

    公开(公告)日:2012-09-18

    申请号:US12214350

    申请日:2008-06-16

    IPC分类号: H01L51/50

    摘要: Disclosed are light emitting display and method of manufacturing the same. The light emitting display according to the present embodiments includes a first substrate including a plurality of light emitting devices and a pad portion, all of which are formed therein; a second substrate disposed to face the light emitting devices; and a bonding layer bonded to the light emitting devices and the second substrate, wherein a stepped portion is formed at a predetermined depth in an edge of the second substrate that is adjacent to the pad portion, and the bonding layer is extended to the stepped portion. Since the bonding layer is not bonded to the pad portion due to the depth of the stepped portion when the second substrate is bonded to the first substrate, poor electrical contact may be prevented, and it easy to remove the encapsulation substrate to expose the pad portion. Also, the manufacturing process is simple, the process uniformity is high and the process time is short since the bonding layer is formed in the front of the second substrate.

    摘要翻译: 公开了发光显示器及其制造方法。 根据本实施例的发光显示器包括:第一基板,包括多个发光器件和焊盘部分,所有这些都形成在其中; 设置成面向所述发光器件的第二衬底; 以及粘合到所述发光器件和所述第二基板的接合层,其中在所述第二基板的与所述焊盘部分相邻的边缘中的预定深度处形成阶梯部分,并且所述接合层延伸到所述台阶部分 。 由于当第二基板接合到第一基板时由于阶梯部分的深度而不与焊盘部分接合接合层,所以可以防止差的电接触,并且容易移除封装基板以露出焊盘部分 。 此外,制造工艺简单,由于在第二衬底的前面形成接合层,工艺均匀性高,处理时间短。

    Light emitting display and method of manufacturing the same
    6.
    发明申请
    Light emitting display and method of manufacturing the same 有权
    发光显示器及其制造方法

    公开(公告)号:US20090066214A1

    公开(公告)日:2009-03-12

    申请号:US12214350

    申请日:2008-06-16

    IPC分类号: H01J1/62

    摘要: Disclosed are light emitting display and method of manufacturing the same. The light emitting display according to the present embodiments includes a first substrate including a plurality of light emitting devices and a pad portion, all of which are formed therein; a second substrate disposed to face the light emitting devices; and a bonding layer bonded to the light emitting devices and the second substrate, wherein a stepped portion is formed at a predetermined depth in an edge of the second substrate that is adjacent to the pad portion, and the bonding layer is extended to the stepped portion. Since the bonding layer is not bonded to the pad portion due to the depth of the stepped portion when the second substrate is bonded to the first substrate, poor electrical contact may be prevented, and it easy to remove the encapsulation substrate to expose the pad portion. Also, the manufacturing process is simple, the process uniformity is high and the process time is short since the bonding layer is formed in the front of the second substrate.

    摘要翻译: 公开了发光显示器及其制造方法。 根据本实施例的发光显示器包括:第一基板,包括多个发光器件和焊盘部分,所有这些都形成在其中; 设置成面向所述发光器件的第二衬底; 以及粘合到所述发光器件和所述第二基板的接合层,其中在所述第二基板的与所述焊盘部分相邻的边缘中的预定深度处形成阶梯部分,并且所述接合层延伸到所述台阶部分 。 由于当第二基板接合到第一基板时由于阶梯部分的深度而不与焊盘部分接合接合层,所以可以防止差的电接触,并且容易移除封装基板以露出焊盘部分 。 此外,制造工艺简单,由于在第二衬底的前面形成接合层,工艺均匀性高,处理时间短。