公开(公告)号：US20070086114A1

公开(公告)日：2007-04-19

申请号：US11610314

申请日：2006-12-13

申请人： Shane Van Sloun ,  Mark Christianson ,  Stevenson Marek ,  James Mahoney ,  Mark Schmidt ,  Brandon Fraser ,  Jeffry Bennin

发明人： Shane Van Sloun ,  Mark Christianson ,  Stevenson Marek ,  James Mahoney ,  Mark Schmidt ,  Brandon Fraser ,  Jeffry Bennin

IPC分类号： G11B5/48

CPC分类号： G11B5/4813 ,  G11B5/4833 ,  Y10T29/49021 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49181 ,  Y10T29/49192

摘要： A method of making a multi-piece head suspension for a rigid disk drive. The method includes providing a first layer including a mounting region with an integral boss tower attached to a stiffener by one or more positioning tabs; attaching a second layer including a spring region to an interface between the mounting region and the stiffener; attaching a flexure to the stiffener; and removing the positioning tabs. The flexure can optionally be a portion of the second layer.

摘要翻译： 制造用于刚性盘驱动器的多片头悬架的方法。 该方法包括提供包括具有通过一个或多个定位翼片附接到加强件的整体凸台塔的安装区域的第一层; 将包括弹簧区域的第二层附接到所述安装区域和所述加强件之间的界面; 将挠曲件附接到加强件; 并移除定位卡舌。 挠曲件可以可选地是第二层的一部分。

公开(公告)号：US20050195528A1

公开(公告)日：2005-09-08

申请号：US10794681

申请日：2004-03-05

申请人： Jeffry Bennin ,  Reid Danielson ,  Galen Houk

发明人： Jeffry Bennin ,  Reid Danielson ,  Galen Houk

IPC分类号： G11B5/48 ,  G11B5/60 ,  G11B15/64 ,  G11B17/32 ,  G11B21/16 ,  G11B21/20 ,  H05K1/05 ,  H05K3/40 ,  H05K3/44

CPC分类号： G11B5/4846 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K3/4046 ,  H05K3/44 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0195

摘要： A method for forming an electrical interconnect to the spring metal layer in an integrated lead suspension or suspension component of the type having a multi-layer structure including a spring metal layer and a conductor layer separated by a dielectric insulator layer. The method includes forming an aperture through at least one of either the spring metal and conductor layers, and optionally through the dielectric layer, at an interconnect site. A first mass of malleable conductive metal is inserted into the aperture. The mass of metal is then coined to form a stud that engages at least the spring metal layer at the interconnect site. One embodiment of the invention is used to form a bond pad stud that is free from contact with the conductor layer. Another embodiment is used to form an electrical interconnect stud that electrically connects the spring metal and conductor layers. The invention can also be used to mount integrated lead flexures to load beams.

摘要翻译： 一种用于在具有包括弹性金属层和由电介质绝缘体层隔开的导体层的多层结构的类型的集成铅悬浮或悬挂部件中形成与弹簧金属层的电互连的方法。 该方法包括在互连位置处通过弹簧金属和导体层中的至少一个，以及任选地通过介电层形成孔。 将第一质量的韧性导电金属插入孔中。 然后将金属质量打造成形成在互连位置处至少与弹簧金属层接合的螺柱。 本发明的一个实施例用于形成不与导体层接触的接合焊盘螺柱。 另一个实施例用于形成电连接弹簧金属和导体层的电互连柱。 本发明还可用于将集成引线弯曲件安装到负载梁。

公开(公告)号：US20080088975A1

公开(公告)日：2008-04-17

申请号：US11876320

申请日：2007-10-22

申请人： Jeffry Bennin ,  Reid Danielson ,  Galen Houk

发明人： Jeffry Bennin ,  Reid Danielson ,  Galen Houk

IPC分类号： G11B15/64

CPC分类号： G11B5/4846 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K3/4046 ,  H05K3/44 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0195

摘要： A method for forming an electrical interconnect to the spring metal layer in an integrated lead suspension or suspension component of the type having a multi-layer structure including a spring metal layer and a conductor layer separated by a dielectric insulator layer. The method includes forming an aperture through at least one of either the spring metal and conductor layers, and optionally through the dielectric layer, at an interconnect site. A first mass of malleable conductive metal is inserted into the aperture. The mass of metal is then coined to form a stud that engages at least the spring metal layer at the interconnect site.

摘要翻译： 一种用于在具有包括弹性金属层和由电介质绝缘体层隔开的导体层的多层结构的类型的集成铅悬浮或悬挂部件中形成与弹簧金属层的电互连的方法。 该方法包括在互连位置处通过弹簧金属和导体层中的至少一个，以及任选地通过介电层形成孔。 将第一质量的韧性导电金属插入孔中。 然后将金属质量打造成形成在互连位置处至少与弹簧金属层接合的螺柱。