公开(公告)号：US20240353525A1

公开(公告)日：2024-10-24

申请号：US18224786

申请日：2023-07-21

Applicant: Shanghai Tianma Micro-electronics Co., Ltd.

Inventor： Yifan XING ,  Feng QIN ,  Baiquan LIN ,  Xiaonan HAN ,  Yifan BAO ,  Ping SU ,  Shengwei DAI ,  Zhenyu JIA ,  Zhen LIU ,  Xiaojun CHEN

IPC: G01S7/03 ,  G01S13/02 ,  H01P1/18 ,  H01P11/00

CPC classification number: G01S7/03 ,  G01S13/02 ,  H01P1/18 ,  H01P11/00

Abstract: A sensor and its fabrication method are provided. The sensor includes a first glass substrate, a circuit layer on a side of the first glass substrate, and a radio frequency processing chip on a side of the circuit layer away from the first glass substrate.

公开(公告)号：US20240165608A1

公开(公告)日：2024-05-23

申请号：US18114446

申请日：2023-02-27

Applicant: Shanghai Tianma Micro-electronics Co., Ltd.

Inventor： Kaidi ZHANG ,  Baiquan LIN ,  Yunfei BAI ,  Wei LI ,  Xiaojun CHEN ,  Qingsan ZHU

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/12

Abstract: Microfluidic device and application method thereof are provided. The microfluidic device includes a first substrate and a second substrate that are oppositely arranged along a first direction; and a first storage box and a second storage box that are oppositely arranged along the first direction. The first direction is a thickness direction of the microfluidic device. The first storage box includes a first storage cavity and a first opening communicating with the first storage cavity, and the first substrate is fixed in the first storage cavity. The second storage box includes a second storage cavity and a second opening communicating with the second storage cavity, and the second substrate is fixed in the second storage cavity. Along the first direction, the first opening is arranged opposite to the second opening and the first storage box is nested with the second storage box.