公开(公告)号：US20240010810A1

公开(公告)日：2024-01-11

申请号：US18033829

申请日：2020-11-10

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Weifeng YIN ,  Qianfa LIU ,  Jianying SHI ,  Jiangling ZHANG ,  Sha LI ,  Songgang CHAI ,  Yongjing XU ,  Cui HUO

IPC: C08K3/22 ,  C08L101/12 ,  C08J5/18 ,  C08K5/00 ,  B32B15/08

CPC classification number: C08K3/22 ,  C08L101/12 ,  C08J5/18 ,  C08K5/0066 ,  B32B15/08 ,  C08K2003/2265

Abstract: A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55° C. to 150° C. is 0-1000 ppm/° C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.

公开(公告)号：US20210307164A1

公开(公告)日：2021-09-30

申请号：US17162122

申请日：2021-01-29

Applicant: Shengyi Technology Co., Ltd.

Inventor： Weifeng YIN ,  Cui HUO ,  Rui LIU ,  Yongjing XU ,  Shanyin YAN

IPC: H05K1/03 ,  C09J153/02 ,  C09J179/08 ,  C09J171/12 ,  C09J11/06

Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.