公开(公告)号：US10429681B1

公开(公告)日：2019-10-01

申请号：US16427284

申请日：2019-05-30

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: H01L21/00 ,  G02F1/1333 ,  H01L27/12 ,  G02F1/1345 ,  G02F1/1362 ,  H01L29/423 ,  G09G3/36 ,  H01L29/417

Abstract: The invention provides a structure of GOA circuit, which is manufactured on both sides of the ultra-thin flexible substrate with holes, wherein the wires pass through the holes to connect the TFTs in the GOA circuit on the front side to the TFTs in the GOA circuit on the back side to reduce the area occupied by GOA circuit. As such, the circuit area utilization is improved so that the same size of substrate area can carry almost twice the circuit structure to reduce the border width of the non-active area to achieve borderless or ultra-narrow border display panel with high resolution.

公开(公告)号：US10338421B2

公开(公告)日：2019-07-02

申请号：US15503705

申请日：2016-12-27

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: G02F1/1333 ,  G02F1/1362 ,  G09G3/36 ,  G02F1/1345

Abstract: The invention provides a display device, which employs ultra-thin flexible substrate with WOA disposed on both sides of the flexible substrate, wherein the WOA on the front side is directly connected to the active area, and the WOA on the back side passes through the holes in the flexible substrate to extend to the front side to connect to the active area. As such, the circuit area utilization is improved so that the same size of substrate area can carry almost twice the circuit structure to reduce the border width of the non-active area to achieve borderless or ultra-narrow borders.

公开(公告)号：US20190285932A1

公开(公告)日：2019-09-19

申请号：US16427284

申请日：2019-05-30

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: G02F1/1333 ,  H01L27/12 ,  G02F1/1345 ,  G02F1/1362 ,  H01L29/423 ,  H01L29/417 ,  G09G3/36

Abstract: The invention provides a structure of GOA circuit, which is manufactured on both sides of the ultra-thin flexible substrate with holes, wherein the wires pass through the holes to connect the TFTs in the GOA circuit on the front side to the TFTs in the GOA circuit on the back side to reduce the area occupied by GOA circuit. As such, the circuit area utilization is improved so that the same size of substrate area can carry almost twice the circuit structure to reduce the border width of the non-active area to achieve borderless or ultra-narrow border display panel with high resolution.

公开(公告)号：US10359656B2

公开(公告)日：2019-07-23

申请号：US15503707

申请日：2016-12-27

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: H01L21/00 ,  G02F1/1333 ,  G02F1/1362 ,  H01L27/12 ,  H01L29/417 ,  H01L29/423 ,  G09G3/36 ,  G02F1/1345

Abstract: The invention provides a structure of GOA circuit, which is manufactured on both sides of the ultra-thin flexible substrate with holes, wherein the wires pass through the holes to connect the TFTs in the GOA circuit on the front side to the TFTs in the GOA circuit on the back side to reduce the area occupied by GOA circuit. As such, the circuit area utilization is improved so that the same size of substrate area can carry almost twice the circuit structure to reduce the border width of the non-active area to achieve borderless or ultra-narrow border display panel with high resolution.

公开(公告)号：US10477689B2

公开(公告)日：2019-11-12

申请号：US15503704

申请日：2016-12-30

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: H05K1/18 ,  G02F1/1333 ,  H05K1/02 ,  H05K3/28 ,  H05K3/00 ,  G09F9/30 ,  G02F1/1345 ,  G02F1/136

Abstract: The invention provides a manufacturing method for flexible array substrate. The method comprises: adhering the flexible substrate to the rigid support plate to manufacture the back side driver circuit and the protective layer on the back side driver circuit; peeling the flexible substrate off, turning the flexible substrate over and then adhering again to the rigid supporting plate to manufacture the protecting layer and the adhesive layer; forming holes, front side driver circuit and display circuit on the flexible substrate, the back side driver circuit electrically connected to the display circuit and the back side driver circuit electrically connected to the display circuit through the holes to obtain a flexible array substrate with double-sided circuit structure. By distributing the circuit structure of the non-active area to both sides of flexible substrate, the width of the non-active area is reduced to realize an ultra-narrow border or borderless display.

公开(公告)号：US20180210265A1

公开(公告)日：2018-07-26

申请号：US15503707

申请日：2016-12-27

Applicant: Shenzhen China Star Optoelectronics Technology Co. Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: G02F1/1333 ,  G02F1/1362 ,  H01L27/12 ,  G09G3/36 ,  H01L29/417 ,  H01L29/423

CPC classification number: G02F1/133305 ,  G02F1/13454 ,  G02F1/136227 ,  G02F1/136286 ,  G02F2201/42 ,  G09G3/3648 ,  G09G2300/0408 ,  G09G2300/043 ,  H01L27/1218 ,  H01L27/124 ,  H01L29/41733 ,  H01L29/42384

Abstract: The invention provides a structure of GOA circuit, which is manufactured on both sides of the ultra-thin flexible substrate with holes, wherein the wires pass through the holes to connect the TFTs in the GOA circuit on the front side to the TFTs in the GOA circuit on the back side to reduce the area occupied by GOA circuit. As such, the circuit area utilization is improved so that the same size of substrate area can carry almost twice the circuit structure to reduce the border width of the non-active area to achieve borderless or ultra-narrow border display panel with high resolution.

公开(公告)号：US20180213648A1

公开(公告)日：2018-07-26

申请号：US15503704

申请日：2016-12-30

Applicant: Shenzhen China Star Optoelectronics Technology Co. Ltd.

Inventor： Gang Wang ,  Lixuan Chen

IPC: H05K1/18 ,  H05K1/02 ,  G02F1/1333 ,  G02F1/1345

Abstract: The invention provides a manufacturing method for flexible array substrate. The method comprises: adhering the flexible substrate to the rigid support plate to manufacture the back side driver circuit and the protective layer on the back side driver circuit; peeling the flexible substrate off, turning the flexible substrate over and then adhering again to the rigid supporting plate to manufacture the protecting layer and the adhesive layer; forming holes, front side driver circuit and display circuit on the flexible substrate, the back side driver circuit electrically connected to the display circuit and the back side driver circuit electrically connected to the display circuit through the holes to obtain a flexible array substrate with double-sided circuit structure. By distributing the circuit structure of the non-active area to both sides of flexible substrate, the width of the non-active area is reduced to realize an ultra-narrow border or borderless display.